Abstract:
In a method of producing trench-like depressions (24) in the surface of a wafer (27), particularly a silicon wafer, by plasma etching, in which the depressions (24) are produced by alternate passivation and etching, each depression (24) in its final geometry is provided with a protective layer (30) of the polytetrafluoroethylene type.
Abstract:
A simple, compact construction and easy manufacture of a swirl nozzle having a plurality of inlet channels and an outlet channel extending transversely thereto are made possible by the fact that the inlet channels open directly and/or tangentially into the outlet channel. Alternatively or additionally, upstream of the inlet channels is provided a filter structure having smaller flow cross-sections than the inlet channels. The swirl nozzle is used, in particular, for atomizing a liquid medicament formulation. The swirl nozzle is produced from two plate-shaped components, the outlet channel first being etched as a blind bore in one component and then opened up by grinding the component away. Alternatively or additionally, the outlet channel is formed in a different component from the inlet channels.