Three-dimensional Integrated Circuit
    1.
    发明公开

    公开(公告)号:US20230223402A1

    公开(公告)日:2023-07-13

    申请号:US17573648

    申请日:2022-01-12

    Applicant: Kneron Inc.

    CPC classification number: H01L27/0688 H01L27/0248 H01L27/0207

    Abstract: A 3D integrated circuit includes a substrate, a first layer on top of the substrate, and a second layer on top of the first layer. The first layer includes a first chip, and a first network bridge formed at a first side of the first chip. The second layer includes a second chip, and a second network bridge formed at a first side of the second chip. The first chip and the first network bridge are coupled to the substrate through bumps. The second chip is coupled to the first chip and the first network bridge through bumps. The second network bridge is coupled to the first network bridge through bumps. The first network bridge and the second network bridge each include a network switch for controlling data transfer and/or power distribution.

    K-CLUSTER RESIDUE NUMBER SYSTEM FOR EDGE AI COMPUTING

    公开(公告)号:US20240152329A1

    公开(公告)日:2024-05-09

    申请号:US17978235

    申请日:2022-11-01

    Applicant: Kneron Inc.

    CPC classification number: G06F7/72 G06F7/575

    Abstract: A k-cluster residue number system has a processor and memory coupled to the processor. The processor is used to generate a modular set composed of P coprime integers, generate a dynamic range by taking a product of the P coprime integers, generate quotient indices for all integers in the dynamic range, generate row indices for all integers in the dynamic range, generate column indices for all integers in the dynamic range, and generate a look-up table according to the quotient indices, row indices, the column indices, and all integers in the dynamic range. P is an integer greater than 2, and the P coprime integers include 2. The memory is used to store the look-up table.

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