公开(公告)号：US12070736B2

公开(公告)日：2024-08-27

申请号：US17046042

申请日：2019-02-19

Applicant: Korea Advanced Institute of Science and Technology

Inventor： Seokwoo Jeon ,  Donghwi Cho ,  Junyong Park

IPC: B01D53/00 ,  B01D53/04 ,  B01J20/06 ,  B01J20/08 ,  B01J20/28 ,  G01N33/00 ,  G03F1/26

CPC classification number: B01J20/28095 ,  B01D53/0438 ,  B01J20/06 ,  B01J20/08 ,  G01N33/0011 ,  B01D2259/40096 ,  G01N33/0019 ,  G03F1/26

Abstract: The disclosed pre-concentrator comprises: a base substrate having a trench; a metal layer conformally disposed along the inner surface of the trench; and a three-dimensional porous nanostructure disposed on the metal layer in the trench and having aligned pores connected to each other in three dimensions. The pre-concentrator can improve the concentration performance of a sample and the thermal desorption efficiency of a concentrated sample.

公开(公告)号：US11490859B2

公开(公告)日：2022-11-08

申请号：US16486245

申请日：2018-02-05

Applicant: Korea Advanced Institute of Science and Technology

Inventor： Seok-woo Jeon ,  Tae-Hoon Kim ,  Dong-hwi Cho ,  Junyong Park

IPC: G08B21/04 ,  A61B5/00 ,  H01L21/56 ,  H01L21/768 ,  A61B5/25 ,  H01L21/60

Abstract: In a method of manufacturing a biomimetic highly stretchable conductive dry adhesive patch, a mold including a plurality of holes is provided by etching a semiconductor substrate including an insulation layer based on a footing effect. A conductive polymer composite is provided by dispersing mixed conductive fillers in a liquid elastomer. The mixed conductive fillers are formed by mixing one-dimensional conductive fillers and two-dimensional conductive fillers. The conductive polymer composite is applied on the mold such that the conductive polymer composite is injected into the plurality of holes. A conductive dry adhesive structure including a plurality of micropillars corresponding to the plurality of holes is obtained by performing a post-treatment on the conductive polymer composite applied on the mold and by removing the mold. Each of the plurality of micropillars includes a body portion and a tip portion. The tip portion has a spatula shape, is formed on the body portion, and has an area larger than that of the body portion in a plan view.

公开(公告)号：US20200337640A1

公开(公告)日：2020-10-29

申请号：US16486245

申请日：2018-02-05

Applicant: Korea Advanced Institute of Science and Technology

Inventor： Seok-woo Jeon ,  Tae-Hoon Kim ,  Dong-hwi Cho ,  Junyong Park

IPC: A61B5/00 ,  H01L21/768 ,  H01L21/56

Abstract: In a method of manufacturing a biomimetic highly stretchable conductive dry adhesive patch, a mold including a plurality of holes is provided by etching a semiconductor substrate including an insulation layer based on a footing effect. A conductive polymer composite is provided by dispersing mixed conductive fillers in a liquid elastomer. The mixed conductive fillers are formed by mixing one-dimensional conductive fillers and two-dimensional conductive fillers. The conductive polymer composite is applied on the mold such that the conductive polymer composite is injected into the plurality of holes. A conductive dry adhesive structure including a plurality of micropillars corresponding to the plurality of holes is obtained by performing a post-treatment on the conductive polymer composite applied on the mold and by removing the mold. Each of the plurality of micropillars includes a body portion and a tip portion. The tip portion has a spatula shape, is formed on the body portion, and has an area larger than that of the body portion in a plan view.