公开(公告)号：US20220389606A1

公开(公告)日：2022-12-08

申请号：US17765101

申请日：2020-09-25

Applicant: Korea Institute Of Materials Science

Inventor： Seung-hoe CHOE ,  Myeongjin HAN ,  Man KIM ,  Bung-uk YOO ,  Kyun-hwan LEE ,  Joo-yul LEE ,  Younghwon KWAN

IPC: C25D21/12 ,  C25D21/18

Abstract: Provided are a measurement method, an electrochemical measuring cell, and a measuring device which are capable of directly and continuously measuring the concentration of monovalent copper ions (Cu+), 3-mercaptopropyl sulfonate (MPS), or Cu+-MPS, which is a plating additive breakdown product, in a plating solution during a copper plating process.