公开(公告)号：US20240258677A1

公开(公告)日：2024-08-01

申请号：US18433232

申请日：2024-02-05

Applicant: Kymeta Corporation

Inventor： Steven Howard Linn ,  Mehdi Afkhami Reihani ,  Stephen Olfert ,  Chris Eylander ,  Felix Chen ,  Corey Pfeiff ,  Jonathan Byron

IPC: H01Q1/08 ,  H01Q1/42 ,  H01Q21/00

CPC classification number: H01Q1/085 ,  H01Q1/42 ,  H01Q21/005

Abstract: Expansion compensation structures for an antenna are disclosed. In one embodiment, the antenna comprises: an array of antenna elements; and a structure coupled to the array of antenna elements, the structure having a plurality of components comprising materials having different coefficients of thermal expansion (CTEs), wherein first and second components of the plurality of components are pin bonded with one or more pins, and one or more components of the plurality of components other than the first and second components are between the first and second components and have one or more slots through which the one or more pins traverse and have CTEs different than CTEs of the first and second components.

公开(公告)号：US11909091B2

公开(公告)日：2024-02-20

申请号：US17323800

申请日：2021-05-18

Applicant: Kymeta Corporation

Inventor： Steven Howard Linn ,  Mehdi Afkhami Reihani ,  Stephen Olfert ,  Chris Eylander ,  Felix Chen ,  Corey Pfeiff ,  Jonathan Byron

IPC: H01Q1/38 ,  H01Q1/08 ,  H01Q1/42 ,  H01Q21/00 ,  H01Q21/06

CPC classification number: H01Q1/085 ,  H01Q1/42 ,  H01Q21/005

Abstract: Expansion compensation structures for an antenna are disclosed. In one embodiment, the antenna comprises: an array of antenna elements; and a structure coupled to the array of antenna elements, the structure having a plurality of components comprising materials having different coefficients of thermal expansion (CTEs), wherein first and second components of the plurality of components are pin bonded with one or more pins, and one or more components of the plurality of components other than the first and second components are between the first and second components and have one or more slots through which the one or more pins traverse and have CTEs different than CTEs of the first and second components.

公开(公告)号：US20210273311A1

公开(公告)日：2021-09-02

申请号：US17323800

申请日：2021-05-18

Applicant: Kymeta Corporation

Inventor： Steven Howard Linn ,  Mehdi Afkhami Reihani ,  Stephen Olfert ,  Chris Eylander ,  Felix Chen ,  Corey Pfeiff ,  Jonathan Byron

IPC: H01Q1/08 ,  H01Q21/00 ,  H01Q1/42

Abstract: Expansion compensation structures for an antenna are disclosed. In one embodiment, the antenna comprises: an array of antenna elements; and a structure coupled to the array of antenna elements, the structure having a plurality of components comprising materials having different coefficients of thermal expansion (CTEs), wherein first and second components of the plurality of components are pin bonded with one or more pins, and one or more components of the plurality of components other than the first and second components are between the first and second components and have one or more slots through which the one or more pins traverse and have CTEs different than CTEs of the first and second components.