公开(公告)号：US20200270037A1

公开(公告)日：2020-08-27

申请号：US16761141

申请日：2018-11-01

Applicant: Kyodo Printing Co., Ltd.

Inventor： Atsushi YASUDA ,  Kenta SUZUKI ,  Shinichi KONDO

IPC: B65D65/40 ,  B65D75/36 ,  B65D81/26 ,  B32B27/32 ,  B32B27/30 ,  B32B7/12 ,  B32B15/09 ,  B32B15/20 ,  B32B27/36 ,  B32B7/06

Abstract: A cover material for blister packs according to the present invention is sequentially provided with a base material layer, an absorption layer and an easily releasable layer in this order. This cover material for blister packs is configured such that: the absorption layer has a skin layer on the easily releasable layer-side surface; the absorption layer contains a resin for absorption layers and an absorbent the skin layer contains a resin for skin layers, but does not contain an absorbent; and the easily releasable resin layer contains an easily releasable resin.