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公开(公告)号:US20240360350A1
公开(公告)日:2024-10-31
申请号:US18140602
申请日:2023-04-27
Applicant: L2Y CO.,LTD.
Inventor: Hak Gue YEO , June HUH , Ye Il KIM
CPC classification number: C09K5/14 , C08G77/08 , C08G77/12 , C08G77/20 , C08J5/18 , C08K13/06 , C08L83/04 , C08J2383/04 , C08K2003/282 , C08K3/36 , C08K7/18 , C08K9/06 , C08K2201/001 , C08K2201/005 , C08K2201/011 , C08K2201/014 , C08L2205/025
Abstract: Provided are a heat dissipation molding agent having an excellent heat dissipation property and a heat dissipation film formed using the heat dissipation molding agent. In two different component-type heat dissipation molding agents, various forms of heat dissipation fillers are included in a silicone resin. The heat dissipation fillers are treated to be hydrophobic, and an anti-settling agent is introduced to the heat dissipation molding agent. Accordingly, the miscibility of the heat dissipation fillers is improved and excellent heat dissipation properties are acquired.