公开(公告)号：US20180255648A1

公开(公告)日：2018-09-06

申请号：US15758217

申请日：2017-03-21

Applicant: LG CHEM, LTD.

Inventor： Chang Hui LEE ,  Dong Hyun KIM

IPC: H05K3/42 ,  H05K1/11 ,  H05K1/09 ,  H05K3/06 ,  H05K3/00 ,  H05K3/28 ,  H05K3/46

CPC classification number: H05K3/42 ,  H05K1/0265 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0011 ,  H05K3/06 ,  H05K3/282 ,  H05K3/3447 ,  H05K3/429 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4644 ,  H05K2201/09572 ,  H05K2203/0502 ,  H05K2203/0548

Abstract: The present disclosure relates to a structure and a method for filling a via hole formed in a multilayer printed circuit board, and more particularly, to a structure and a method for filling a via hole formed in a multilayer printed circuit board, the structure and method enabling high-current transmission even in a narrow space in such a way that a via hole formed when a typical multilayer printed circuit board is manufactured is first filled with Cu and Ag plating, and the remaining vacant space is completely filled with a solder cream, thereby increasing the amount of conductors.