公开(公告)号：US20180287032A1

公开(公告)日：2018-10-04

申请号：US15766167

申请日：2016-12-01

Applicant: LG CHEM, LTD.

Inventor： Dae Ki LEE ,  Dong-Sik KIM ,  Cheol-Hee PARK

IPC: H01L35/08 ,  H01B1/22

Abstract: The present invention relates to a metal paste including: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and to a thermoelectric module which adopts a bonding technique using the metal paste.

公开(公告)号：US20170236614A1

公开(公告)日：2017-08-17

申请号：US15504268

申请日：2015-09-17

Applicant: LG CHEM, LTD.

Inventor： Shin Hee JUN ,  Dae Ki LEE ,  Se Hui SOHN ,  Han Nah JEONG ,  Cheol-Hee PARK ,  Chee-Sung PARK ,  Jae Hyun KIM ,  Ha Na LEE

IPC: H01B5/14 ,  H05K3/10 ,  H05K1/03 ,  C23C18/40 ,  C08L69/00 ,  C08J7/12 ,  C23C18/16 ,  C23C18/20 ,  H01B1/22 ,  C08K3/32

CPC classification number: H01B5/14 ,  C08J7/123 ,  C08J2369/00 ,  C08J2483/04 ,  C08K3/32 ,  C08K2003/328 ,  C08L69/00 ,  C08L2203/20 ,  C08L2205/06 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/405 ,  H01B1/026 ,  H01B1/22 ,  H05K1/0313 ,  H05K1/0373 ,  H05K3/105 ,  H05K3/182 ,  H05K2201/012 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2203/072 ,  H05K2203/107 ,  Y10T428/24802 ,  Y10T428/24917

Abstract: The present invention relates to a composition for forming a conductive pattern and a resin structure having a conductive pattern, wherein the composition makes it possible to form a fine conducive pattern on various polymer resin products or resin layers through a simple process, and can more effectively meet needs of the art, such as displaying various colors.