公开(公告)号：US20230111455A1

公开(公告)日：2023-04-13

申请号：US17910765

申请日：2021-12-09

Applicant: LG CHEM, LTD.

Inventor： Ji Hye LEE ,  Myeung ll KIM ,  Moo Seok LEE ,  Jae Chan PARK

IPC: C08L69/00 ,  C08L55/02 ,  C08L63/10 ,  C08L67/03 ,  B29B7/00 ,  B29C48/36 ,  B29C48/00

Abstract: The present invention relates to a thermoplastic resin composition, a method of preparing the same and a molded article including the same. More particularly, the thermoplastic resin composition includes a polycarbonate resin having a limited melt flow index, a polyorganosiloxane-polycarbonate resin, a vinyl cyanide compound-conjugated diene rubber-aromatic vinyl compound copolymer, a polyester resin and an epoxy group-containing copolymer in predetermined weight ratios.