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公开(公告)号：US20190115562A1
公开(公告)日：2019-04-18
申请号：US16091063
申请日：2017-04-12
Applicant: LG CHEM, LTD.
Inventor： Jung Ok MOON , Hyun Jee YOO , Hyun Suk KIM , Jung Woo LEE , Se Woo YANG
Abstract: The present application relates to an encapsulation film, a method for manufacturing the same, an organic electronic device comprising the same and a method for manufacturing an organic electronic device using the same. The present invention provides an encapsulation film which can form a structure capable of effectively blocking moisture or oxygen flowing from the outside into an organic electronic device, has excellent handling property and workability, and has excellent adhesion property and endurance reliability between the encapsulation film and the organic electronic device.
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公开(公告)号：US20190077120A1
公开(公告)日：2019-03-14
申请号：US16082508
申请日：2017-03-13
Applicant: LG CHEM, LTD.
Inventor： Hyun Suk KIM , Hyun Jee YOO , Jung Ok MOON , Jung Woo LEE , Se Woo YANG
IPC: B32B15/085 , B32B27/18 , C08J5/18 , H01L51/52 , H01L51/56
Abstract: The present application relates to an encapsulating film, a reliability assessment therefor, an organic electronic apparatus comprising the encapsulating film, and a method for producing an organic electronic apparatus which has used the encapsulating film, and provides: a reliability assessment method which can predict the reliability of the encapsulating film before same is applied to the organic electronic apparatus, the encapsulating film blocking moisture or oxygen from the outside entering the organic electronic apparatus; and the encapsulating film which can block moisture with high reliability.
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Patent Agency Ranking
公开(公告)号：US20180297853A1
公开(公告)日：2018-10-18
申请号：US15770360
申请日：2017-03-17
Applicant: LG CHEM, LTD.
Inventor： Eunsu JANG , Yoo Seok KIM , Jaesung KIM , Jeong Kyu KIM , Jin Hyoung YOO , Jung Woo LEE , Ye Hoon IM , Jun Won CHOI
Abstract: A method for manufacturing polysilicon, according to the present invention, is capable of manufacturing polysilicon with high purity more efficiently in such a manner that a high-temperature and high-speed air stream is formed at the center of a reaction tube, and a high-temperature region may be formed by a vortex formed by the high-temperature and high-speed air stream, so that a raw gas supplied from the side wall of the reaction tube flows by the guiding of the vortex, thereby increasing a stay time and a reaction time of the raw gas within the reaction tube. Furthermore, since the inner wall of the reaction tube is provided with a heat release means, the rapid cooling of a silicon crystal deposited on the inner wall of the reaction tube can induce a columnar crystal in which the silicon crystal is solidified in a direction perpendicular to a crystal face, and it is easy to desorb the silicon crystal produced by rapid heat release via the inner wall of the reaction tube.
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公开(公告)号：US20180366684A1
公开(公告)日：2018-12-20
申请号：US15747073
申请日：2017-03-07
Applicant: LG CHEM, LTD.
Inventor： Hyun Suk KIM , Se Woo YANG , Hyun Jee YOO , Hyun Hee SON , Jung Ok MOON , Hyoung Sook PARK , Ban Seok CHOI , Jung Woo LEE
Abstract: The present application relates to a display device. The present application can provide a display device in which reflection of external light is reduced to improve a contrast ratio. Such a display device can be applied to not only OLED, a self-luminous display device, but also various display devices including LCD, a non-self-luminous display device, and the like, and can be also implemented as a flexible display device.
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公开(公告)号：US20190157612A1
公开(公告)日：2019-05-23
申请号：US16091394
申请日：2017-04-12
Applicant: LG CHEM, LTD.
Inventor： Hyun Jee YOO , Hyun Suk KIM , Jung Ok MOON , Se Woo YANG , Jae Jin KIM , Dae Han SEO , Min Soo SONG , Jung Woo LEE
Abstract: The present application relates to an encapsulation film, a method of manufacturing the same, an organic electronic device including the same, and a method of manufacturing the organic electronic device using the same. The present application provides an encapsulation film which can be formed to have a structure in which moisture or oxygen flowing from the outside into an organic electronic device can be effectively blocked, has excellent handling properties and processability, and also has excellent bonding properties with an organic electronic element and durability.
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公开(公告)号：US20200381664A1
公开(公告)日：2020-12-03
申请号：US16954897
申请日：2018-12-18
Applicant: LG CHEM, LTD.
Inventor： Kyung Yul BAE , Hyun Jee YOO , Jung Woo LEE , Se Woo YANG
Abstract: The present application provides an encapsulation film comprising an encapsulation layer, a metal layer, and a protective layer. The encapsulation film provides a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside, minimizes the appearance change of the film due to excellent handling properties and processability, and prevents physical and chemical damage during encapsulation process.
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公开(公告)号：US20190123299A1
公开(公告)日：2019-04-25
申请号：US16090014
申请日：2017-04-03
Applicant: LG CHEM, LTD.
Inventor： Jung Woo LEE , Hyun Jee YOO , Hyun Suk KIM , Jung Ok MOON , Se Woo YANG
Abstract: The present application relates to an encapsulation film, a method for manufacturing the same, a method for manufacturing an organic electronic device using the same, and an organic electronic device comprising the same, and provides an encapsulation film which allows forming a structure capable of effectively blocking moisture or oxygen introduced into the organic electronic device from the outside, and has excellent handleability and processability, and excellent bonding property between the encapsulation layer and the panel of the organic electronic device and endurance reliability.
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