公开(公告)号：US20180223141A1

公开(公告)日：2018-08-09

申请号：US15913431

申请日：2018-03-06

Applicant: LG CHEM, LTD.

Inventor： Hyun Jee YOO ,  Yoon Gyung CHO ,  Suk Ky CHANG ,  Jung-Sup SHIM

IPC: C09J163/00 ,  C09J11/04 ,  C09J7/10 ,  H05B33/10 ,  C09J9/00 ,  C08K3/36 ,  C08K3/34 ,  C08K3/22 ,  C08K3/013

CPC classification number: C09J163/00 ,  C08K3/013 ,  C08K3/22 ,  C08K3/346 ,  C08K3/36 ,  C08K2201/008 ,  C09J7/10 ,  C09J9/00 ,  C09J11/04 ,  C09J133/08 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H05B33/10 ,  Y10T428/2848

Abstract: The present invention relates to an adhesive composition, an adhesive film, a method of manufacturing the adhesive film and an organic electronic device (OED) that are used to encapsulate an organic electronic element. The adhesive composition can form an encapsulant layer having an excellent adhesive property, impact resistance, heat-protecting property and moisture blocking property, so that an OED that includes an element encapsulated with the adhesive composition can exhibit an excellent lifespan property and durability.