Abstract:
A polyimide copolymer according to the present invention has a particular structure in which siloxane structures are distributed in a nanosize in a polymer and thus enables excellent transparency, heat resistance, mechanical strength and flexibility and effective reduction of residual stress, and thus can be used in various fields such as a substrate for a device, a cover substrate for a display, an optical film, an integrated circuit (IC) package, an adhesive film, a multi-layer flexible printed circuit (FPC), tape, a touch panel and a protective film for an optical disk.
Abstract:
Described is a polyimide prepared from a diamine containing a spiro or cardo group in a molecule structure, wherein the dimensional stability of the polyimide can be improved at a high temperature, and thus the polyimide can provide a polyimide film useful for a flexible substrate.
Abstract:
A modified polyimide represented by Formula 4: wherein D is a heat curable or photocurable functional group, R is a divalent or higher polyvalent organic group, and n is an integer of 1 or greater, X1, X2, X3, and X4 are each independently a tetravalent organic group derived from a tetracarboxylic dianhydride, Y1, Y2, and Y3 are each independently a divalent organic group derived from a diamine, p, q, r, and v are each independently an integer of 0 or greater, with the proviso that p, q, r, and v are not simultaneously 0, and r+v is 1 or greater. Additionally, curable resin compositions including the modified polyimide, as well as polyimide films including a cured product of the curable resin composition, and methods for preparing the modified polyimide.
Abstract:
The present invention relates to a polyimide-based solution that can be used to produce an isotropic transparent polyimide-based film with high heat resistance and excellent mechanical properties as well as high transmittance. A coating of the polyimide-based solution on a substrate has a haze of 1% or less after storage at a temperature of 30° C. and a humidity of 70% for 30 minutes.
Abstract:
The laminate for manufacturing a flexible substrate according to the present invention is formed by using a polyimide having a high absorbance to a UV laser in an organic sacrificial layer for delaminating a flexible substrate from a carrier substrate. Therefore, it is possible that the laser energy density required in the delaminating process using laser irradiation is reduced and the amount of as generated by the delaminating process is remarkably reduced so that the efficiency of the process, the permeability of the flexible substrate is improved and the reliability of the device is improved.
Abstract:
A method for producing a device substrate by obtaining a laminate comprising a carrier substrate, a first polyimide film comprising a first polyimide resin disposed on at least one surface of the carrier substrate, a second polyimide film disposed on the first polyimide film opposite to the surface of the first polyimide film formed on a surface of the carrier substrate; applying a physical stimulus to the second polyimide film without causing chemical changes in the first polyimide film such that the cross-sections of the second polyimide film are exposed and cross-sectional surfaces of the first polyimide film are not exposed and no physical stimulus is applied to the surface of the carrier substrate, wherein the adhesive strength of the first polyimide to the second polyimide film decreases when the second polyimide film in the laminate is cut to expose cross-sectional surfaces of the second polyimide film; and separating the second polyimide film from the first polyimide film formed on the carrier substrate to obtain the device.
Abstract:
The present invention relates to a polyimide-based solution that can be used to produce an isotropic transparent polyimide-based film with high heat resistance and excellent mechanical properties as well as high transmittance. A coating of the polyimide-based solution on a substrate has a haze of 1% or less after storage at a temperature of 30° C. and a humidity of 70% for 30 minutes.
Abstract:
The present invention provides a novel diamine compound capable of producing a polymer which exhibits greatly enhanced mechanical properties and heat resistance while maintaining transparency. A film including a polymer produced using the diamine compound has excellent transparency, heat resistance, mechanical strength and flexibility, and thus can be used in various fields, such as in a device substrate, a display cover substrate, an optical film, an Integrated circuit (IC) package, an adhesive film, a multi-layer flexible printed circuit (FPC), a tape, a touch panel and an optical disc protection film, and the like.
Abstract:
The present invention provides a polyimide film forming composition which comprises a polyamic acid or a polyimide in an oligomer form or in a low-molecular weight form, the polyamic acid or the polyimide being prepared from a diamine containing an intramolecular imide group, and thus can provide a polyimide film having improved heat resistance while retaining optical properties thereof. In addition, the polyimide film according to the present invention can reduce not only a laser energy density (E/D) required in the laser exfoliation process but also remarkably decrease an amount of ash generated by an exfoliation process, thereby further improving the reliability of a device in a display manufacturing process.
Abstract:
The present invention provides a polyamidimide film which maintains transparency and has highly enhanced mechanical properties and heat resistance. The polyamidimide shows excellent transparency, heat resistance, mechanical strength and flexibility and thus can be used in various fields such as substrates for devices, cover substrates for displays, optical films, integrated circuit (IC) packages, adhesive films, multi-layer flexible printed circuits (FPC), tapes, touch panels and protective films for optical disks.