POLYIMIDE COPOLYMER AND POLYIMIDE FILM USING SAME

    公开(公告)号:US20210292555A1

    公开(公告)日:2021-09-23

    申请号:US16482885

    申请日:2018-07-17

    Applicant: LG CHEM, LTD.

    Abstract: A polyimide copolymer according to the present invention has a particular structure in which siloxane structures are distributed in a nanosize in a polymer and thus enables excellent transparency, heat resistance, mechanical strength and flexibility and effective reduction of residual stress, and thus can be used in various fields such as a substrate for a device, a cover substrate for a display, an optical film, an integrated circuit (IC) package, an adhesive film, a multi-layer flexible printed circuit (FPC), tape, a touch panel and a protective film for an optical disk.

    MODIFIED POLYIMIDE AND CURABLE RESIN COMPOSITION

    公开(公告)号:US20190309118A1

    公开(公告)日:2019-10-10

    申请号:US16391879

    申请日:2019-04-23

    Applicant: LG CHEM, LTD.

    Abstract: A modified polyimide represented by Formula 4: wherein D is a heat curable or photocurable functional group, R is a divalent or higher polyvalent organic group, and n is an integer of 1 or greater, X1, X2, X3, and X4 are each independently a tetravalent organic group derived from a tetracarboxylic dianhydride, Y1, Y2, and Y3 are each independently a divalent organic group derived from a diamine, p, q, r, and v are each independently an integer of 0 or greater, with the proviso that p, q, r, and v are not simultaneously 0, and r+v is 1 or greater. Additionally, curable resin compositions including the modified polyimide, as well as polyimide films including a cured product of the curable resin composition, and methods for preparing the modified polyimide.

    DIAMINE COMPOUND AND METHOD FOR PRODUCING SAME

    公开(公告)号:US20190292138A1

    公开(公告)日:2019-09-26

    申请号:US16316536

    申请日:2017-08-11

    Applicant: LG CHEM, LTD.

    Abstract: The present invention provides a novel diamine compound capable of producing a polymer which exhibits greatly enhanced mechanical properties and heat resistance while maintaining transparency. A film including a polymer produced using the diamine compound has excellent transparency, heat resistance, mechanical strength and flexibility, and thus can be used in various fields, such as in a device substrate, a display cover substrate, an optical film, an Integrated circuit (IC) package, an adhesive film, a multi-layer flexible printed circuit (FPC), a tape, a touch panel and an optical disc protection film, and the like.

    POLYIMIDE FILM FORMING COMPOSITION AND POLYIMIDE FILM PRODUCED BY USING SAME

    公开(公告)号:US20190276618A1

    公开(公告)日:2019-09-12

    申请号:US16345523

    申请日:2017-10-27

    Applicant: LG CHEM, LTD.

    Abstract: The present invention provides a polyimide film forming composition which comprises a polyamic acid or a polyimide in an oligomer form or in a low-molecular weight form, the polyamic acid or the polyimide being prepared from a diamine containing an intramolecular imide group, and thus can provide a polyimide film having improved heat resistance while retaining optical properties thereof. In addition, the polyimide film according to the present invention can reduce not only a laser energy density (E/D) required in the laser exfoliation process but also remarkably decrease an amount of ash generated by an exfoliation process, thereby further improving the reliability of a device in a display manufacturing process.

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