公开(公告)号：US20210167461A1

公开(公告)日：2021-06-03

申请号：US17252839

申请日：2020-04-14

Applicant: LG CHEM, LTD.

Inventor： Min-Jae LEE ,  Jong-Hun KIM ,  Sung-Min HWANG

IPC: H01M50/403 ,  H01M50/463 ,  H01M10/0583

Abstract: A separator sealing apparatus for bonding an upper separator and a lower separator with an electrode plate being interposed therebetween and a separator sealing method is provided. The separator sealing apparatus includes a first sealing unit configured to seal a first region specified as an outer edge along a width direction of the electrode plate, among portions where the upper separator and the lower separator face each other; and a second sealing unit configured to seal a second region specified as an outer edge along a length direction of the electrode plate, among the portions where the upper separator and the lower separator face each other.