DISPLAY DEVICE COMPRISING SEMICONDUCTOR LIGHT-EMITTING ELEMENT

    公开(公告)号:US20240304774A1

    公开(公告)日:2024-09-12

    申请号:US18575361

    申请日:2022-06-24

    CPC classification number: H01L33/62 H01L25/0753

    Abstract: The display device according to the embodiment includes a substrate; a first assembly wiring and second assembly wiring alternately arranged on the substrate and spaced apart from each other; a first insulating layer disposed between the first assembly wiring and the second assembly wiring and having different first and second thicknesses; a planarization layer disposed on the first assembly wiring and the second assembly wiring and having a first opening; and a light emitting device disposed inside the first opening, wherein a first electrode overlaps the first assembly wiring and the second assembly wiring, wherein the first electrode is configured to be electrically connected to either the first assembly wiring or the second assembly wiring.

    DISPLAY DEVICE COMPRISING SEMICONDUCTOR LIGHT-EMITTING ELEMENT

    公开(公告)号:US20250054923A1

    公开(公告)日:2025-02-13

    申请号:US18720393

    申请日:2022-09-05

    Abstract: The display device according to the embodiment may include a substrate, a first planarization layer containing the first opening on the substrate, a first assembly wiring and a second assembly wiring arranged spaced apart from each other inside the first opening and on the first planarization layer, a second planarization layer covering a portion of the first assembly wiring and the second assembly wiring and including a second opening, a light emitting device disposed inside the second opening, wherein the first electrode overlaps the first assembly wiring and the second assembly wiring, and an insulation layer covering the first assembly wiring or second assembly wiring placed inside the first opening Insulation layer covering the first assembly wiring or second assembly wiring placed inside the first opening, and the first electrode is bonded to one of the first assembly wiring and the second assembly wiring.

    DISPLAY DEVICE COMPRISING SEMICONDUCTOR LIGHT-EMITTING ELEMENT, AND MANUFACTURING METHOD THEREFOR

    公开(公告)号:US20250015243A1

    公开(公告)日:2025-01-09

    申请号:US18713549

    申请日:2022-07-08

    Abstract: A display device and a method of manufacturing the same according to an embodiment include a substrate, first assembly wiring and second assembly wiring alternately arranged on the substrate and overlapping each other, an insulating layer disposed between the first assembly wiring and the second assembly wiring, a planarization layer disposed on the first assembly wiring and the second assembly wiring, and having a first opening, and a light emitting device disposed inside the first opening, wherein the first electrode overlaps the first assembly wiring and the second assembly wiring. And, the first electrode is bonded to one of the first assembly wiring and the second assembly wiring.

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