公开(公告)号：US20150090002A1

公开(公告)日：2015-04-02

申请号：US14503480

申请日：2014-10-01

Applicant: LG INNOTEK CO., LTD.

Inventor： Jee Heum PAIK ,  Yun Mi BAE ,  Go Eun HWANG

IPC: G01N33/00 ,  H01C7/04

CPC classification number: G01N33/0027 ,  B81B7/0061 ,  B81B2201/0214 ,  B81B2207/012 ,  G01N27/128 ,  G01N2033/0095 ,  H01C7/04 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16227 ,  H01L2224/81411 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2924/00014 ,  H01L2924/10157 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2224/05599

Abstract: Provided is a gas sensor package, including: a first substrate including a gas inflow hole; and a gas sensing element mounted to the first substrate and including a gas sensing portion disposed to correspond to the gas inflow hole.

Abstract translation: 提供一种气体传感器封装，包括：第一基板，包括气体流入孔; 以及气体感测元件，其安装到第一基板，并且包括设置成对应于气体流入孔的气体感测部分。