公开(公告)号：US12010795B2

公开(公告)日：2024-06-11

申请号：US17638898

申请日：2020-08-25

Applicant: LG INNOTEK CO., LTD.

Inventor： Il Sik Nam ,  Yong Suk Kim ,  Dong Keun Lee ,  Tae Ki Kim ,  Hye Jin Jo

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/113 ,  H05K1/0256 ,  H05K2201/09118

Abstract: A printed circuit board according to an embodiment includes an insulating layer; a first pad disposed on an upper surface of the insulating layer; a second pad disposed on a lower surface of the insulating layer; a first device mounted on the first pad; a second device mounted on the second pad; a first molding layer disposed on the insulating layer and molding the first device; and a second molding layer disposed on the lower surface of the insulating layer and molding the second device, wherein a lower surface of the second molding layer is positioned on the same plane as a lower surface of the second device.

公开(公告)号：US20240292534A1

公开(公告)日：2024-08-29

申请号：US18657331

申请日：2024-05-07

Applicant: LG INNOTEK CO., LTD.

Inventor： Il Sik Nam ,  Yong Suk Kim ,  Dong Keun Lee ,  Tae Ki Kim ,  Hye Jin Jo

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/113 ,  H05K1/0256 ,  H05K2201/09118

Abstract: A printed circuit board according to an embodiment includes an insulating layer; a first pad disposed on an upper surface of the insulating layer; a second pad disposed on a lower surface of the insulating layer; a first device mounted on the first pad; a second device mounted on the second pad; a first molding layer disposed on the insulating layer and molding the first device; and a second molding layer disposed on the lower surface of the insulating layer and molding the second device, wherein a lower surface of the second molding layer is positioned on the same plane as a lower surface of the second device.