公开(公告)号：US20240120265A1

公开(公告)日：2024-04-11

申请号：US18274946

申请日：2022-01-28

Applicant: LG INNOTEK CO., LTD.

Inventor： Sang Young LEE ,  Dong Min KIM ,  Jin Soo BAE

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49838 ,  H01L21/4857 ,  H01L23/49822

Abstract: A circuit board according to an embodiment comprises an insulating layer; an electrode layer disposed on the insulating layer; and a protective layer disposed on the insulating layer and including an opening vertically overlapping at least a portion of an upper surface of the electrode layer; wherein the electrode layer includes: a first layer disposed on the insulating layer; a second layer disposed on the first layer; a third layer disposed on the second layer; and a fourth layer disposed on the third layer, wherein a width of the second layer is greater than a width of the third layer, wherein a thickness of the second layer is greater than a thickness of the third layer, and wherein a height of an upper surface of the protective layer is equal to or less than a height of an upper surface of the third layer.