公开(公告)号：US20230413425A1

公开(公告)日：2023-12-21

申请号：US18037825

申请日：2021-11-19

Applicant: LG INNOTEK CO., LTD.

Inventor： Myung Jae KWON ,  Dong Sun KIM ,  Sang Hyuck NAM ,  Sung Wuk RYU ,  Chang Woo YOO ,  Ju Hyun LEE

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0272 ,  H05K1/113 ,  H05K1/0271 ,  H05K2201/09409 ,  H05K2201/09381 ,  H05K2201/09781 ,  H05K3/4038

Abstract: A circuit board according to an embodiment includes a first insulating layer including a first region and a second region; and a first circuit pattern layer disposed on the first insulating layer; wherein the first circuit pattern layer includes a first electrode disposed on the first region of the first insulating layer and including a first opening, and wherein the first opening pass through upper and lower surfaces of the first electrode.