公开(公告)号：US20200013932A1

公开(公告)日：2020-01-09

申请号：US16480485

申请日：2018-01-17

Applicant: LG INNOTEK CO., LTD.

Inventor： Ji Hyung MOON ,  Kyoung Un KIM ,  Sun Woo PARK ,  June O SONG ,  Sun Woo OH ,  Sang Jun LEE ,  Hwan Hee JEONG ,  Myung Ho HAN

IPC: H01L33/50 ,  H01L33/56 ,  H01L33/32 ,  H01L33/10 ,  H01L33/60 ,  H01L33/62 ,  H01L27/15

Abstract: A semiconductor device package according to the present invention comprises: a semiconductor device including a substrate, a light-emitting structure, and a first pad and second pad electrically connected to the light-emitting structure; a wavelength converting unit disposed to surround the upper surface and side surfaces of the semiconductor device; and a light control unit disposed on the wavelength converting unit, wherein the wavelength converting unit may include an upper surface spaced a first spacing interval apart in a vertical direction from the semiconductor device, and a side surface spaced a second spacing interval apart in a horizontal direction from the semiconductor device. The present invention relates to a semiconductor device package and a light source module. A semiconductor device package according to the present invention may include a semiconductor device for emitting light, a wavelength converting unit, and a light control unit and may emit white light in directions of four side surfaces surrounding the wavelength converting unit and in an upward direction of the light control unit. A wavelength converting unit according to the present invention may be disposed at the upper surface of a semiconductor device and four side surfaces surrounding the semiconductor device, receive light emitted from the semiconductor device and incident thereto and diffuse the received light, convert the wavelength of light incident thereto and provide the converted light, and emit white light in four side surface directions and in an upward direction. A light control unit according to the present invention may be disposed on the upper surface of a wavelength converting unit, reflect a part of white light incident thereon from the wavelength converting unit, and transmit a part of the white light.

公开(公告)号：US20190165226A1

公开(公告)日：2019-05-30

申请号：US16098340

申请日：2017-05-02

Applicant: LG INNOTEK CO., LTD.

Inventor： Kyoung Un KIM ,  Young Jun KO ,  In Hyun CHO

IPC: H01L33/60 ,  H01L33/06 ,  H01L33/12 ,  H01L33/14 ,  H01L33/22 ,  H01L33/32 ,  H01L33/38 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62 ,  H01L23/544

Abstract: An embodiment provides a semiconductor element package which comprises: a semiconductor element comprising a first electrode pad and a second electrode pad, arranged on one surface thereof; a reflective member disposed on a side surface of the semiconductor element and having a sloping surface; a light-transmitting layer disposed on the sloping surface of the reflective member; and a wavelength conversion member disposed on the semiconductor element and the light-transmitting layer, wherein the sloping surface of the reflective member slopes such that the distance from the side surface of the semiconductor element increases along first direction, the first direction is a direction from one surface of the semiconductor element toward the other surface thereof, and, as the distance from the side surface of the semiconductor element increases, the thickness of the light-transmitting layer decreases and the thickness of the reflective member increases.

公开(公告)号：US20170200874A1

公开(公告)日：2017-07-13

申请号：US15314118

申请日：2015-05-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Dae Geun KIM ,  Kyoung Un KIM ,  Seul Ki KIM ,  Bong Kul MIN ,  Gyu Hyeong BAK

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/64 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An embodiment comprises: a substrate having a chip mounting region; first and second wiring layers disposed on the substrate around the chip mounting region so as to be spaced apart from each other; and a plurality of light emitting chips disposed on the chip mounting region, wherein the first wiring layer comprises a first wiring pattern disposed at one side of a reference line and having a first concave part, and a first extending pattern extending from the first wiring pattern to the other side of the reference line, the second wiring layer comprises a second wiring pattern disposed at the other side of the reference line and having a second concave part, and a second extending pattern extending from the second wiring pattern to one side of the reference line, and the reference line is a straight line passing through the center of the chip mounting region.