公开(公告)号：US20170208692A1

公开(公告)日：2017-07-20

申请号：US15328190

申请日：2015-07-24

Applicant: LG INNOTEK CO., LTD.

Inventor： Jae Hyun AHN ,  Min Wook YU

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/184 ,  H01L33/486 ,  H01L33/62 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/115 ,  H05K1/185 ,  H05K3/007 ,  H05K3/421 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2203/1563

Abstract: A printed circuit board includes an insulating layer and an element embedded in the insulating layer and exposed through a surface of the insulating layer.