公开(公告)号：US20150296624A1

公开(公告)日：2015-10-15

申请号：US14438660

申请日：2013-05-09

Applicant: LG INNOTEK CO., LTD.

Inventor： Yun Ho An ,  Won Suk Jung ,  Ran Kim ,  Sung Soo Park ,  Young Joon Son ,  Sang Myung Lee ,  Woo Young Lee ,  Joon Wook Han

IPC: H05K1/18

CPC classification number: H05K1/185 ,  H01L21/568 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/4602 ,  H05K2201/09136 ,  H05K2201/095 ,  H05K2201/0959 ,  H05K2201/10636 ,  H05K2203/0191 ,  Y02P70/611

Abstract: A printed circuit board for mounting a chip includes: a core layer including a chip mounting cavity; a chip mounted into the chip mounting cavity; a first insulating material layer filled in a space between the chip mounting cavity and the chip; and a second insulating material layer laminated on one surface of the core layer.

Abstract translation: 用于安装芯片的印刷电路板包括：芯层，包括芯片安装腔; 芯片安装在芯片安装腔中; 填充在芯片安装腔和芯片之间的空间中的第一绝缘材料层; 以及层叠在芯层的一个表面上的第二绝缘材料层。