公开(公告)号：US20210267043A1

公开(公告)日：2021-08-26

申请号：US17252172

申请日：2019-06-14

Applicant: LG INNOTEK CO., LTD.

Inventor： Do Hyuk YOO ,  Hee Jung LEE ,  Young Ju HAN ,  Young Il LEE

IPC: H05K1/02 ,  H05K1/11 ,  H01S5/024

Abstract: A printed circuit board according to an embodiment comprises: a substrate comprising at least two insulating layers; pads arranged on the substrate; heat dissipation vias arranged to pass through the substrate in a region of the substrate which vertically overlaps the pads; and through vias arranged to pass through the substrate in a region of the substrate which does not vertically overlap the pads, wherein each heat dissipation via includes a plurality of via parts which are spaced apart from each other in at least one of the at least two insulating layers, the upper surface of each of the plurality of via parts has a first horizontal width in a first direction that is smaller than a second horizontal width thereof in a second direction different from the first direction, and the plurality of via parts have a surface area corresponding to 10% or greater of the surface area of the pads.