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公开(公告)号：US12144103B2
公开(公告)日：2024-11-12
申请号：US17252172
申请日：2019-06-14
Applicant: LG INNOTEK CO., LTD.
Inventor： Do Hyuk Yoo , Hee Jung Lee , Young Ju Han , Young Il Lee
Abstract: A printed circuit board according to an embodiment comprises: a substrate comprising at least two insulating layers; pads arranged on the substrate; heat dissipation vias arranged to pass through the substrate in a region of the substrate which vertically overlaps the pads; and through vias arranged to pass through the substrate in a region of the substrate which does not vertically overlap the pads, wherein each heat dissipation via includes a plurality of via parts which are spaced apart from each other in at least one of the at least two insulating layers, the upper surface of each of the plurality of via parts has a first horizontal width in a first direction that is smaller than a second horizontal width thereof in a second direction different from the first direction, and the plurality of via parts have a surface area corresponding to 10% or greater of the surface area of the pads.
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公开(公告)号：US10468554B2
公开(公告)日：2019-11-05
申请号：US15740167
申请日：2016-06-17
Applicant: LG INNOTEK CO., LTD.
Inventor： Young Ju Han , Jina Gu , Hyun Gu Im
Abstract: A light-emitting device according to an embodiment of the present invention includes a substrate; a light-emitting structure provided on the substrate, and including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer provided between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode provided on the light-emitting structure; a first connecting electrode provided on the first electrode; a second electrode provided on the light-emitting structure; a second connecting electrode provided on the second electrode; and a support layer provided around the first electrode, the first connecting electrode, the second electrode and the second connecting electrode. The support layer includes a first support layer having a first coefficient of thermal expansion, and a second support layer provided on the first support layer and having a second coefficient of thermal expansion.
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公开(公告)号：US09893235B2
公开(公告)日：2018-02-13
申请号：US14618599
申请日：2015-02-10
Applicant: LG INNOTEK CO., LTD.
Inventor： Pil Geun Kang , Hee Seok Choi , Seok Beom Choi , Ju Won Lee , Deok Ki Hwang , Young Ju Han
CPC classification number: H01L33/22 , H01L33/20 , H01L33/40 , H01L33/405 , H01L33/44 , H01L33/50 , H01L33/62 , H01L33/641 , H01L33/642 , H01L33/644 , H01L2224/16245 , H01L2924/01322 , H01L2924/00
Abstract: A light emitting device is provided a transmissive substrate; a first pattern portion including a protrusions; a second pattern portion including a concaves having a width smaller than a width of each protrusion; a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer, under the transmissive substrate; a first electrode under the first conductive semiconductor layer; a reflective electrode layer under the second conductive semiconductor layer; a second electrode under the reflective electrode layer; a first connection electrode under the first electrode; a second connection electrode under the second electrode; and an insulating support member around the first electrode and the first connection electrode and around the second electrode and the second connection electrode. A transmissive resin layer is on the transmissive substrate and an insulating layer is between the insulating support member and the reflective electrode layer.
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Patent Agency Ranking
4.发明授权公开(公告)号：US09595640B2
公开(公告)日：2017-03-14
申请号：US13732628
申请日：2013-01-02
Applicant: LG INNOTEK CO., LTD.
Inventor： Seok Hun Bae , Seok Beom Choi , Pil Geun Kang , Deok Ki Hwang , Young Ju Han , Hee Seok Choi , Young Rok Park , Tae Don Lee , Hyun Sung Oh , Jee Hue Joo , Dong Woo Kang , Sung Sig Kim
CPC classification number: H01L33/405 , H01L33/20 , H01L33/382 , H01L33/44 , H01L33/486 , H01L33/62 , H01L33/641 , H01L2224/14 , H01L2224/16225 , H01L2224/16245 , H01L2924/01322 , H01L2924/1301 , H01L2924/00
Abstract: Disclosed are a light emitting device, a light emitting device package and a light emitting module. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer between the first and second conductive semiconductor layers; a support member under the light emitting structure; a reflective electrode layer between the second conductive semiconductor layer and the support member; and first to third connection electrodes spaced apart from each other in the support member. The second connection electrode is disposed between the first and third connection electrodes, the first and third connection electrodes are electrically connected with each other, and the support member is disposed at a peripheral portion of the first to third connection electrodes.
Abstract translation: 公开了发光器件，发光器件封装和发光模块。 发光器件包括发光结构，其包括第一导电半导体层，第二导电半导体层和在第一和第二导电半导体层之间的有源层; 在发光结构下的支撑构件; 在所述第二导电半导体层和所述支撑构件之间的反射电极层; 以及在支撑构件中彼此间隔开的第一至第三连接电极。 第二连接电极设置在第一和第三连接电极之间，第一和第三连接电极彼此电连接，并且支撑构件设置在第一至第三连接电极的周边部分。
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公开(公告)号：US09468096B2
公开(公告)日：2016-10-11
申请号：US14651783
申请日：2013-12-06
Applicant: LG INNOTEK CO., LTD.
Inventor： Sungjin Yun , Jae Man Park , Jong Heum Yoon , Young Ju Han
IPC: H05K1/05 , B32B15/092 , B32B27/20 , B32B27/26 , B32B27/38 , C08G59/24 , C08G59/50 , C08L63/00 , C08K3/22 , C08K3/38 , H05K1/03
CPC classification number: H05K1/0373 , C08K3/22 , C08K3/38 , C08K2003/2227 , C08K2003/385 , H05K1/056 , H05K2201/0209 , H05K2201/0215 , C08L63/00
Abstract: According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler includes boron nitride (BN).
Abstract translation: 根据本发明的一个实施方案，环氧树脂组合物包含环氧化合物，固化剂和无机填料，其中无机填料包括氮化硼（BN）。
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公开(公告)号：US12111533B2
公开(公告)日：2024-10-08
申请号：US17754762
申请日：2020-09-22
Applicant: LG INNOTEK CO., LTD.
Inventor： In Hae Lee , Young Ju Han , Byung Sook Kim , Kweon Jin Lee , Jun Sik Shin
IPC: G02F1/1335 , G02F1/1681 , H10K59/80
CPC classification number: G02F1/133524 , G02F1/133512 , G02F1/133514 , G02F1/1681 , H10K59/8791
Abstract: An optical path control member according to an embodiment comprises: a first substrate; a first electrode arranged on the upper surface of the first substrate; a second substrate arranged on top of the first substrate; a second electrode arranged on the lower surface of the second substrate; and an optical conversion unit which is arranged between the first electrode and the second electrode and which defines a first direction and a second direction, wherein the optical conversion unit comprises a partition part and an accommodation part that are alternately arranged in the first direction, the accommodation part includes a plurality of cells arranged to be spaced in the second direction, at least one of the cells includes a first inner side surface and a second inner side surface that are connected to each other, and the first inner side surface and/or the second inner side surface extends in a direction other than the first and second directions.
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公开(公告)号：US09673366B2
公开(公告)日：2017-06-06
申请号：US14925251
申请日：2015-10-28
Applicant: LG INNOTEK CO., LTD.
Inventor： Deok Ki Hwang , Young Ju Han , Hee Seok Choi , Ju Won Lee , Pil Geun Kang , Seok Beom Choi
IPC: H01L33/06 , H01L33/62 , H01L33/38 , H01L33/40 , H01L33/32 , H01L33/46 , H01L33/48 , H01L33/64 , H01L33/00 , H01L33/44 , H01L33/50
CPC classification number: H01L33/62 , H01L33/0079 , H01L33/06 , H01L33/32 , H01L33/385 , H01L33/405 , H01L33/44 , H01L33/46 , H01L33/483 , H01L33/505 , H01L33/507 , H01L33/641 , H01L2224/16
Abstract: A light emitting device may be provided that includes a substrate, a light emitting structure, a first electrode on a part of the first semiconductor layer, an electrode layer on the second conductive semiconductor layer, an insulating layer on the electrode layer, a second electrode on the electrode layer, a support member on the insulating layer, a first connection electrode connected to the first electrode, and a second connection electrode connected to the second electrode. The insulating layer is disposed on a side surface of the light emitting structure and the part of the first semiconductor layer. The insulating layer includes a first layer and a second layer having a different material from the first layer. The first layer of the insulating layer has a refractive index different from the second layer of the insulating layer.
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公开(公告)号：US09397261B2
公开(公告)日：2016-07-19
申请号：US13677566
申请日：2012-11-15
Applicant: LG INNOTEK CO., LTD.
Inventor： Pil Geun Kang , Hee Seok Choi , Seok Beom Choi , Ju Won Lee , Deok Ki Hwang , Young Ju Han
CPC classification number: H01L33/22 , H01L33/20 , H01L33/40 , H01L33/405 , H01L33/44 , H01L33/50 , H01L33/62 , H01L33/641 , H01L33/642 , H01L33/644 , H01L2224/16245 , H01L2924/01322 , H01L2924/00
Abstract: A light emitting device is provided a transmissive substrate; a first pattern portion including a protrusions; a second pattern portion including a concaves having a width smaller than a width of each protrusion; a light emitting structure under the transmissive substrate and including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer; a first electrode under the first conductive semiconductor layer; a reflective electrode layer under the second conductive semiconductor layer; a second electrode under the reflective electrode layer; a first connection electrode under the first electrode; a second connection electrode under the second electrode; and an insulating support member around the first electrode and the first connection electrode and around the second electrode and the second connection electrode and including a ceramic-based thermal diffusion agent.
Abstract translation: 发光装置设置有透射基板; 包括突起的第一图案部分; 第二图案部分，其包括宽度小于每个突起的宽度的凹部; 在透射基底下方的发光结构，包括第一导电半导体层，第二导电半导体层和有源层; 在第一导电半导体层下方的第一电极; 第二导电半导体层下方的反射电极层; 反射电极层下方的第二电极; 第一电极下方的第一连接电极; 在第二电极下方的第二连接电极; 以及绝缘支撑构件，其围绕所述第一电极和所述第一连接电极并且围绕所述第二电极和所述第二连接电极并且包括陶瓷基热扩散剂。
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