公开(公告)号：US20150185148A1

公开(公告)日：2015-07-02

申请号：US14171378

申请日：2014-02-03

Applicant: LINGSEN PRECISION INDUSTRIES, LTD.

Inventor： Tzu-Chih LIN ,  Chien-Ko LIAO

IPC: G01N21/61 ,  H01L23/00 ,  C09J5/00 ,  G01N33/00

CPC classification number: G01N33/0027 ,  G01N21/3504 ,  G01N2021/3155 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/16151 ,  H01L2924/181 ,  Y10T29/49128 ,  Y10T156/10 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A gas sensor having a micro-package structure includes a light-emitting unit, a light-receiving unit, and a signal-processing unit all deposited on a substrate, and a package body fixed to the substrate and having a chamber and a through hole. The chamber accommodates all the units and the through hole is over the substrate. Gas enters the chamber through the through hole. The light-emitting unit emits an optical signal that passes through the gas and then is received by the light-receiving unit. Then a signal-processing unit electrically connected to the light-receiving unit performs spectral analysis. Thereby, the gas sensor is advantageous for requiring low packaging costs and being compact.

Abstract translation: 具有微封装结构的气体传感器包括全部沉积在基板上的发光单元，光接收单元和信号处理单元，以及固定到基板上的具有室和通孔的封装体 。 该室容纳所有单元，通孔位于基板上。 气体通过通孔进入腔室。 发光单元发射通过气体的光信号，然后被光接收单元接收。 然后，电连接到光接收单元的信号处理单元进行光谱分析。 因此，气体传感器对于要求低的包装成本和紧凑性是有利的。

公开(公告)号：US20150206852A1

公开(公告)日：2015-07-23

申请号：US14262199

申请日：2014-04-25

Applicant: LINGSEN PRECISION INDUSTRIES, LTD.

Inventor： Tzu-Chih LIN ,  Chien-Ko LIAO

IPC: H01L23/00 ,  H05K1/03 ,  H01L23/498

CPC classification number: H01L24/81 ,  H01L23/13 ,  H01L23/49822 ,  H01L24/83 ,  H01L25/0655 ,  H01L2224/10175 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/81007 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/83815 ,  H01L2924/15786 ,  H01L2924/3841 ,  H05K1/0306 ,  H05K3/0023 ,  H05K3/341 ,  H05K2201/09036 ,  H05K2201/09045 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A copper clad laminate is disclosed to include a substrate defining a plurality of carrier zones for attachment of chips and having a plurality of barrier portions each arranged around at least one of the carrier zones for isolating the carrier zones. Thus, when tin sheets mounted between the chips and the carrier zones of the substrate become liquids in a thermal reflow process, the barrier portions of the substrate will stop an overflow of molten tin to prevent the chips from damage caused by a solder bridge problem.

公开(公告)号：US20150255423A1

公开(公告)日：2015-09-10

申请号：US14720496

申请日：2015-05-22

Applicant: LINGSEN PRECISION INDUSTRIES, LTD.

Inventor： Tzu-Chih LIN ,  Chien-Ko LIAO

IPC: H01L23/00

CPC classification number: H01L24/81 ,  H01L23/13 ,  H01L23/49822 ,  H01L24/83 ,  H01L25/0655 ,  H01L2224/10175 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/81007 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/83815 ,  H01L2924/15786 ,  H01L2924/3841 ,  H05K1/0306 ,  H05K3/0023 ,  H05K3/341 ,  H05K2201/09036 ,  H05K2201/09045 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A copper clad laminate is disclosed to include a substrate defining a plurality of carrier zones for attachment of chips and having a plurality of barrier portions each arranged around at least one of the carrier zones for isolating the carrier zones. Thus, when tin sheets mounted between the chips and the carrier zones of the substrate become liquids in a thermal reflow process, the barrier portions of the substrate will stop an overflow of molten tin to prevent the chips from damage caused by a solder bridge problem.

Abstract translation: 公开了一种覆铜层压板，其包括限定用于连接芯片的多个载体区域的基板，并且具有多个阻挡部分，每个阻挡部分围绕至少一个承载区域布置以隔离载体区域。 因此，当安装在芯片和衬底的载体区域之间的锡片在热回流过程中变成液体时，衬底的阻挡部分将停止熔融锡的溢出，以防止芯片由于焊料桥问题而造成损坏。

公开(公告)号：US20150187735A1

公开(公告)日：2015-07-02

申请号：US14256776

申请日：2014-04-18

Applicant: LINGSEN PRECISION INDUSTRIES, LTD.

Inventor： Chien-Ko LIAO ,  Tzu-Chih LIN

IPC: H01L25/065 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L25/0652 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40106 ,  H01L2224/40135 ,  H01L2224/40227 ,  H01L2224/73263 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2225/06579 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2224/84

Abstract: A chip stack structure using conductive film bridge adhesive technology comprises a substrate, a first chip, at least one bridge element, a conductive film, and a second chip. The first chip is electrically connected to a first electrode of the substrate. The at least one bridge element has a first bridge surface and a second bridge surface at two ends, and the first bridge surface and the second bridge surface are electrically connected to the first chip and a second electrode of the substrate, respectively. The conductive film is electrically connected to the first bridge surface of the at least one bridge element. The second chip is stacked and electrically connected to the conductive film. Thus, the structure of the present invention not only facilitates the ease of stacking the chips but also increases the effectiveness of the chips heat dissipation and ability of withstanding electrical current.

Abstract translation: 使用导电膜桥接粘合技术的芯片堆叠结构包括基板，第一芯片，至少一个桥接元件，导电膜和第二芯片。 第一芯片电连接到基板的第一电极。 所述至少一个桥接元件在两端具有第一桥接表面和第二桥接表面，并且所述第一桥接表面和所述第二桥接表面分别电连接到所述第一芯片和所述衬底的第二电极。 导电膜电连接到至少一个桥接元件的第一桥接表面。 第二芯片堆叠并电连接到导电膜。 因此，本发明的结构不仅有助于堆叠芯片的容易性，而且还增加了芯片散热的效果和耐受电流的能力。