公开(公告)号：US20160272839A1

公开(公告)日：2016-09-22

申请号：US15032515

申请日：2014-11-10

Applicant: LINTEC CORPORATION

Inventor： Daisuke YAMAMOTO ,  Hiroyuki YONEYAMA

IPC: C09D133/08 ,  H01L23/29 ,  H01L21/56 ,  C08J5/18

CPC classification number: C09D133/08 ,  C08J5/18 ,  C08J2333/08 ,  C08K3/00 ,  C08K2201/001 ,  C08L33/06 ,  C09D133/06 ,  C09D163/00 ,  H01L21/563 ,  H01L23/295 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A composition for protective film formation capable of forming a protective film excellent in attachability by a tape mounter or the like, with good visibility at a laser-printed portion and heat dissipation properties, allowing a protective film-equipped chip having high reliability to be manufactured, and a sheet for protective film formation and a protective film-equipped chip are provided. The composition for protective film formation contains a polymer component (A), a curable component (B), and a heat conductive filler (C) having an average particle size of 2.0 to 10.0 μm. The content of components that are liquid at 25° C. contained in the composition for protective film formation is 20 to 70 parts by mass relative to 100 parts by mass of the total of the (A) component and the (B) component. The content of the (C) component is 40 to 65 volume % relative to the total amount of the composition for protective film formation.

Abstract translation: 一种用于保护膜形成的组合物，其能够通过带式安装机等形成具有优异的附着性的保护膜，在激光打印部分具有良好的可见性和散热性能，允许制造具有高可靠性的保护膜芯片 ，并且提供了用于保护膜形成的片材和装有保护膜的芯片。 保护膜形成用组合物含有平均粒径为2.0〜10.0μm的聚合物成分（A），固化性成分（B）和导热性填充剂（C）。 在保护膜形成用组合物中含有的25℃下液体成分的含量相对于（A）成分和（B）成分的总计100质量份为20〜70质量份。 相对于保护膜形成用组合物的总量，（C）成分的含量为40〜65体积％。