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1.发明申请公开(公告)号：US20250112101A1
公开(公告)日：2025-04-03
申请号：US18832340
申请日：2023-01-19
Applicant: LINTEC CORPORATION
Inventor： Reina KAINUMA
IPC: H01L23/31 , H01L21/56 , H01L21/78 , H01L23/29 , H01L23/552
Abstract: Provided is a curable resin film for use in forming a cured resin film as a protective film on a bump-formed surface of a semiconductor chip having the bump-formed surface provided with a bump, the curable resin film satisfying requirement (1) below: requirement (1): a near-infrared transmittance at 940 nm is less than 13% after thermal curing treatment at 130° C. and 0.5 MPa for 240 minutes.
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