公开(公告)号：US11049991B2

公开(公告)日：2021-06-29

申请号：US16564211

申请日：2019-09-09

Applicant: Lite-On Singapore Pte. Ltd.

Inventor： Suresh Basoor Nijaguna ,  Guo-Jun Xu ,  Kun-Lung Lee ,  Sin-Heng Lim ,  Teck-Chai Goh ,  Yu-Chou Lin

IPC: H01L31/12 ,  H01L33/52 ,  H01L33/58 ,  H01L31/0203 ,  H01L33/44 ,  H01L31/18 ,  H01L31/0216

Abstract: A manufacturing method of an optical module is provided and includes: attaching a light emitting diode light emitting device and a sensor on a substrate; disposing a first encapsulation portion on the light emitting device and the substrate; disposing a second encapsulation portion on the sensor and the substrate; disposing a shielding layer on the first encapsulation portion, the second encapsulation portion and the substrate; removing a first portion of the first encapsulation portion, a second portion of the second encapsulation portion, and a third portion of the shielding layer, and the first portion corresponds to a position of the light emitting device, the second portion corresponds to a position of the sensor, and the third portion corresponds to the positions of the light emitting device and the sensor; and forming a third encapsulation layer on the shielding layer, the first encapsulation portion and the second encapsulation portion.

公开(公告)号：US10107911B1

公开(公告)日：2018-10-23

申请号：US15794481

申请日：2017-10-26

Applicant: LITE-ON SINGAPORE PTE. LTD.

Inventor： Teck-Chai Goh ,  Sin-Heng Lim ,  Guang-Li Song ,  Arakcre Dinesh Gopalaswamy

IPC: G01J5/00 ,  G01S17/02 ,  H05K1/18 ,  H01L25/16 ,  H01L31/16 ,  G01S7/481 ,  H01L31/0232 ,  G06F1/32

Abstract: A proximity sensor and a mobile device using the same are provided. The proximity sensor includes a circuit board, an emitter package, a receiver package, a plastic casing and a lens. The emitter package is disposed on the circuit board and includes an emitter and an emitter housing. The receiver package is disposed on the circuit board and includes a receiver and a receiver housing. The plastic casing covers the emitter package and the receiver package. The plastic casing includes a first opening corresponding to the emitter package and a second opening corresponding to the receiver package. The first opening has a first geometric centerline and the second opening has a second geometric centerline. The height of the emitter package is smaller than that of the receiver package, and the emitter is disposed between the first geometric centerline and the second geometric centerline.

公开(公告)号：US09704837B1

公开(公告)日：2017-07-11

申请号：US15253120

申请日：2016-08-31

Applicant: LITE-ON SINGAPORE PTE. LTD.

Inventor： Teck-Chai Goh ,  Sin-Heng Lim ,  Guang-Li Song

IPC: H01L25/16 ,  H01L25/00 ,  H01L23/58 ,  H01L23/06 ,  H01L31/0203 ,  G01J1/42 ,  G01V8/00

CPC classification number: H01L23/585 ,  G01J1/0209 ,  G01J1/0214 ,  G01J1/4204 ,  G01V8/00 ,  G01V8/10 ,  H01L23/06 ,  H01L25/167 ,  H01L31/0203

Abstract: A detection device and a method of manufacturing the same are disclosed. The detection device includes a detection module and a housing module disposed on the detection module. The detection module includes a substrate, an emission unit, and a detection unit. The substrate includes an emission end area on which the emission unit is disposed, and a receiver end area on which the detection unit is disposed. The housing module includes a plastic housing unit having a receiving space and an opening, and a metallic shielding unit disposed on the plastic housing unit. The receiving space is divided into a first receiving space and a second receiving space by the metallic shielding unit, and the opening is divided into an emission hole and a detection hole by the metallic shielding unit. By the above-mentioned means, the distance between the emission hole and the detection hole is reduced.

公开(公告)号：US10608135B2

公开(公告)日：2020-03-31

申请号：US16117939

申请日：2018-08-30

Applicant: LITE-ON SINGAPORE PTE. LTD.

Inventor： Teck-Chai Goh ,  Sin-Heng Lim ,  Guang-Li Song

IPC: H01L31/16 ,  G01S7/48 ,  G01S17/48 ,  G01S7/481 ,  G01S17/04

Abstract: The instant disclosure provides a wafer level sensing module and a manufacturing method thereof. The wafer level sensing module includes a chip substrate, a proximity sensing unit, and an ambient light sensing unit. The proximity sensing unit is disposed on the chip substrate and includes an emitter, a first receptor, and a shielding assembly. The shielding assembly includes a first shielding member, a second shielding member, a third shielding member, a first lens, and a second lens. The ambient light sensing unit is disposed on the chip substrate and is separate from the proximity sensing unit. The ambient light sensing unit includes a second receptor and a transparent shielding plate. The first receptor and the second receptor are formed on the chip substrate and exposed from a top surface of the chip substrate, and the transparent shielding plate corresponds in position to the second receptor.