公开(公告)号：US20170184282A1

公开(公告)日：2017-06-29

申请号：US15218334

申请日：2016-07-25

Applicant: LONGWIDE TECHNOLOGY INC.

Inventor： HUAN JAN CHIEN ,  MING YANG TSAI

IPC: F21V19/00 ,  F21K9/232 ,  H01L33/64 ,  F21V29/70 ,  H01L25/075 ,  H01L33/62

CPC classification number: F21V19/0025 ,  F21K9/00 ,  F21K9/232 ,  F21K9/90 ,  F21V19/003 ,  F21V29/70 ,  F21V29/83 ,  F21Y2105/12 ,  F21Y2107/00 ,  F21Y2107/10 ,  F21Y2107/20 ,  F21Y2107/70 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/641 ,  H01L2933/0066

Abstract: Disclosed are an LED illumination apparatus and its manufacturing method. A metal sheet is stamped to form a conductive plate with 3D space, and the conductive plate includes an illumination circuit, and a support frame for supporting the conductive plate to form different types of illumination apparatuses. The support frame is provided for supporting and fixing the conductive plate to facilitate the conductive plate to form a 3D curved surface, and an LED chip soldering point protection mechanism is provided for protecting each LED chip soldering point, so that the illumination apparatus is applicable for mass production to improve the yield rate and meet the high heat dissipation efficiency, large-range illumination, material saving, lightweight and/or environmental protection requirements.