公开(公告)号：US20160327242A1

公开(公告)日：2016-11-10

申请号：US14799383

申请日：2015-07-14

Applicant: LUSTROUS TECHNOLOGY LTD.

Inventor： Kao-Hsu CHOU ,  Juei-Khai LIU ,  Chia-Chi LIU

IPC: F21V7/04 ,  F21V29/89 ,  F21V17/06 ,  F21V23/00

CPC classification number: F21V7/04 ,  F21K9/00 ,  F21V17/06 ,  F21V23/005 ,  F21V23/006 ,  F21V29/89 ,  F21Y2115/10 ,  H05K1/113 ,  H05K1/184 ,  H05K2201/0979 ,  H05K2201/10106 ,  H05K2203/167

Abstract: A compact LED module includes: a circuit substrate, formed with an opening, a pair of combination holes and at least one through via area formed with a plurality of through vias; a reflection cup, formed with a light inlet, a light outlet and a pair of combination posts, wherein the pair of combination posts are combined with the pair of combination holes for allowing the reflection cup to be fastened on a first surface of the circuit substrate, and the light inlet is aligned with the opening; and a LED unit, installed with a LED light source and formed with at least one soldering area, wherein each of the soldering areas is connected to each of the through via areas by utilizing solder, thereby allowing the LED unit to be fastened on a second surface of the circuit substrate, and the LED light source is aligned with the opening.

Abstract translation: 紧凑型LED模块包括：形成有开口的电路基板，一对组合孔和形成有多个通孔的至少一个通孔区域; 形成有光入口，光出口和一对组合柱的反射杯，其中所述一对组合柱与所述一对组合孔组合以允许将所述反射杯紧固在所述电路基板的第一表面上 并且光入口与开口对准; 以及LED单元，其安装有LED光源并且形成有至少一个焊接区域，其中每个焊接区域通过利用焊料连接到每个通孔区域，从而允许将LED单元紧固在第二 电路基板的表面，并且LED光源与开口对准。