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    SPOT TIR LENS SYSTEM FOR SMALL HIGH-POWER EMITTER
    1.
    发明申请
    SPOT TIR LENS SYSTEM FOR SMALL HIGH-POWER EMITTER 有权
    用于小型高功率发射器的SPOT TIR镜头系统

    公开(公告)号：US20140369051A1

    公开(公告)日：2014-12-18

    申请号：US14476579

    申请日：2014-09-03

    Applicant: LedEngin, Inc.

    Inventor： WU JIANG ,  XIANTAO YAN ,  DEBO A. ADEBIYI

    IPC: F21V7/00 ,  F21K99/00 ,  F21V5/04

    CPC classification number: F21V7/0091 ,  B29D11/00009 ,  F21K9/00 ,  F21K9/60 ,  F21K9/68 ,  F21V5/04 ,  F21V13/04 ,  F21V29/74 ,  F21W2131/406 ,  F21Y2101/00 ,  F21Y2113/13 ,  F21Y2115/10 ,  G02B19/0028 ,  G02B19/0066

    Abstract: A lamp includes a single emitter structure having a substrate with 25 or more light emitting diodes (LEDs) arranged thereon and a power rating of 80 Watts or more, a total internal reflection (TIR) lens with a plurality of refractive surface regions disposed on the step-shaped upper surface of the optical body, and a holder having a plurality of tabs disposed along an inside rim of the holder and configured for radial compression fit with a flange of the lens, and three or more support members configured for centering the optical body member with respect to the single emitter structure.

    Abstract translation: 一种灯包括单个发射器结构，其具有衬底，其具有布置在其上的25个或更多个发光二极管（LED），并且具有80瓦或更大的额定功率，全内反射（TIR）透镜，其具有多个折射表面区域 光学主体的台阶状上表面和具有沿着保持器的内边缘设置的多个突出部的保持器，其构造成用于与透镜的凸缘径向压配合;以及三个或更多个支撑构件， 主体部件相对于单个发射器结构。

    CERAMIC LED PACKAGE
    3.
    发明申请
    CERAMIC LED PACKAGE 有权
    陶瓷LED包装

    公开(公告)号：US20140209939A1

    公开(公告)日：2014-07-31

    申请号：US14229550

    申请日：2014-03-28

    Applicant: LedEngin, Inc.

    Inventor： XIANTAO YAN

    IPC: H01L25/075 ,  H01L33/64 ,  H01L33/62 ,  H01L33/48

    CPC classification number: H01L33/58 ,  H01L25/0753 ,  H01L33/48 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L33/62 ,  H01L33/64 ,  H01L2924/0002 ,  H01L2933/0058 ,  H01L2924/00

    Abstract: A package for multiple LED's and for attachment to a substrate includes a body, which includes a top body layer, a cavity disposed through the top body layer and having a floor for bonding to the multiple LED's, and a thermal conduction layer bonded to the top body layer and having a top surface forming the floor of the cavity and a bottom surface. The thermal conduction layer includes a thermally conducting ceramic material disposed between the floor and the bottom surface. The package also includes a plurality of LED bonding pads in direct contact with the floor and configured to bond to the multiple LED's and a plurality of electrical bonding pads in direct contact with the floor, proximate to the LED bonding pads, and in electrical communication with a plurality of electrical contacts disposed on a surface of the body.

    Abstract translation: 用于多个LED并用于连接到基板的封装包括主体，其包括顶部主体层，通过顶部主体层设置的空腔，并且具有用于结合到多个LED的底板，以及粘合到顶部的导热层 并且具有形成空腔的底部的顶表面和底表面。 导热层包括设置在地板和底面之间的导热陶瓷材料。 封装还包括与地板直接接触并被配置为结合到多个LED的多个LED焊盘，以及多个与地板直接接触的电接合焊盘，靠近LED焊盘，并与电连接 设置在所述主体的表面上的多个电触头。

    METHOD OF MANUFACTURING CERAMIC LED PACKAGES
    5.
    发明申请
    METHOD OF MANUFACTURING CERAMIC LED PACKAGES 有权
    制造陶瓷LED封装的方法

    公开(公告)号：US20140335636A1

    公开(公告)日：2014-11-13

    申请号：US14338307

    申请日：2014-07-22

    Applicant: LedEngin, Inc.

    Inventor： XIANTAO YAN

    IPC: H01L33/58 ,  H01L33/52 ,  H01L33/48

    CPC classification number: H01L33/58 ,  H01L25/0753 ,  H01L33/48 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L33/62 ,  H01L33/64 ,  H01L2924/0002 ,  H01L2933/0058 ,  H01L2924/00

    Abstract: Methods of fabricating a light-emitting device are provided. A light-emitting device can be formed from bonding a lens including a plug and a cap to an LED package including a socket configured to receive the plug. The lens can be fabricated using an injection mold formed from a well secured to the LED package and injecting a material into the injection mold to cure into a shape of the lens. The lens can also be fabricated using a blank about the shape of the lens and machining the blank to produce the plug and the cap of the lens. The lens can be bonded to the LED package using a convex bead of adhesive deposited on the surface of the LED package and spreading the adhesive between the lens and the LED package.

    Abstract translation: 提供了制造发光器件的方法。 可以通过将包括插头和盖子的透镜结合到包括构造成接收插头的插座的LED封装件来形成发光器件。 透镜可以使用由良好固定到LED封装形成的注射模具来制造，并且将材料注射到注射模具中以固化成透镜的形状。 透镜也可以使用围绕透镜形状的坯件制造，并且加工坯件以产生插头和透镜盖。 透镜可以使用沉积在LED封装表面上的粘合剂的凸珠焊接到LED封装，并将粘合剂铺展在透镜和LED封装之间。

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