公开(公告)号：US20250098384A1

公开(公告)日：2025-03-20

申请号：US18777486

申请日：2024-07-18

Applicant: Lextar Electronics Corporation

Inventor： Jin-Wen LO ,  Yun-Jie TSAI ,  Pin-Feng HUNG ,  Kuo-Jen LAN ,  Cheng-Min HSIEH

IPC: H01L33/62 ,  H01L33/50 ,  H01L33/56

Abstract: A package structure is provided. The package structure includes a lead frame, a first connecting piece, a light-emitting diode, an engaging protrusion, and a fluorescent encapsulant. The lead frame has an upper surface, a lower surface, and a side surface between the upper surface and the lower surface. The first connecting piece is disposed at the center of the upper surface. The light-emitting diode is disposed on the first connecting piece. The engaging protrusion is disposed on the periphery of the upper surface. The fluorescent encapsulant is disposed on the upper surface and covers the light-emitting diode and the engaging protrusion.