公开(公告)号：US20210251084A1

公开(公告)日：2021-08-12

申请号：US16973529

申请日：2019-06-12

Applicant: Linxens Holding

Inventor： Christophe MATHIEU

IPC: H05K3/32

Abstract: The invention relates to a process for manufacturing a roll of flexible carrier bearing electronic components. This process includes a step consisting in adding, to this flexible carrier, electronic components, themselves manufactured from a roll of flexible initial substrate. For example, the electronic components may be manufactured on an initial substrate having a width allowing advantage to be taken of densification of the manufacture of the components on this initial substrate. Subsequently, the singulated electronic components are added to the flexible carrier, allowing, for example, packaging that is more suitable, than possible with the initial substrate, to a use of the electronic components, notably when the latter must be integrated into a chip-card. Thus, for example, the flexible carrier may be, or include, an adhesive, which may or may not be conductive, and which is used to fasten, and optionally connect, each electronic component to a chip-card.

公开(公告)号：US20220216137A1

公开(公告)日：2022-07-07

申请号：US17603829

申请日：2020-04-16

Applicant: Linxens Holding

Inventor： Christophe MATHIEU ,  Carsten NIELAND

IPC: H01L23/498 ,  H01L21/48 ,  G06K19/073

Abstract: Biometric sensor module for a chip card, and method for producing such a module. Method for producing a biometric sensor module for a chip card, including steps of providing a dielectric carrier including a front face and a back face, both forming main faces of the carrier, attaching a biometric sensor for detecting fingerprints to the back face, a detection area covered by the sensor on the back face being placed opposite a detection area on the front face, producing electrically conductive connection pads on the back face of the carrier which are electrically connected to the biometric sensor, at least one connection pad includes a region that is wettable with a solder material, extending over an area of between 0.2 and 5 square millimetres.

公开(公告)号：US20220215220A1

公开(公告)日：2022-07-07

申请号：US17603799

申请日：2020-04-16

Applicant: Linxens Holding

Inventor： Christophe MATHIEU ,  Claire LAURENS DE LOPEZ

IPC: G06K19/073

Abstract: Biometric sensor module for a chip card, and method for producing such a module Method for producing a biometric sensor module for a chip card, including steps of providing a dielectric carrier including a front face and a back face, the front face being coated with an electrically conductive layer in which a bezel is formed, at least one conductive via being made in the thickness of the carrier to electrically connect the bezel to the back face, producing a protective layer on the front face, covering a protection area located inside the bezel, and attaching a biometric sensor for detecting fingerprints to the back face, a detection area covered by the sensor on the back face being placed opposite the protection area.

公开(公告)号：US20240220758A1

公开(公告)日：2024-07-04

申请号：US18288958

申请日：2021-05-21

Applicant: LINXENS HOLDING

Inventor： Carsten NIELAND ,  Christophe MATHIEU

IPC: G06K19/077

CPC classification number: G06K19/0772

Abstract: The present invention relates in various aspects to a module for integrating into card body of a smart card, to a smart card, and to a method of implanting a module into a card body of a smart card. In an aspect, a module for integrating into a card body of a smart card comprises a support, a contact portion formed on a first surface of the support, and a solder material formed on the contact portion, wherein a surface of the solder material is at least partially covered by a flux.

公开(公告)号：US20210133529A1

公开(公告)日：2021-05-06

申请号：US16486967

申请日：2018-03-05

Applicant: Linxens Holding

Inventor： Yean Wei YEAP ,  Christophe MATHIEU ,  Carsten NIELAND ,  Sven DORING

IPC: G06K19/077

Abstract: The invention relates to a chip card including a card body made of plastic material and having several functions possibly managed by a controller and energy supplied by an electrical energy power supply device, such as a battery. Various components, like a chip for bank transactions, a sensor of biometric characteristics, a display device, etc. may be incorporated in modules placed in cavities formed in constituent layers of the body of the card. The invention relates also to a method for fabricating such a chip card.

公开(公告)号：US20190174625A1

公开(公告)日：2019-06-06

申请号：US16321324

申请日：2017-07-28

Applicant: LINXENS HOLDING

Inventor： Eric EYMARD ,  Christophe MATHIEU ,  Jerome DESCHAMPS

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/10 ,  H05K3/32

Abstract: A light radiation emitting device including at least one LED-type device capable of generating a light radiation in a predefined wavelength range and having two electrical contact pads, and a support delimited by first and second opposite sides defining together a thickness of the support, the support supporting at least one LED luminous device and at least one conductive electric track. The electric track is formed of conductive wires. All or part of the conductive wires are bonded to the support along all or part of their length. All or part of the conductive wires have at least one contact portion exposed towards at least one of the first and second sides of the support. Each of the contact pads of the LED-type device is positioned opposite a contact portion of one of the conductive wires and is electrically connected to the contact portion.

公开(公告)号：US20170270398A1

公开(公告)日：2017-09-21

申请号：US15309904

申请日：2015-05-13

Applicant: Linxens Holding

Inventor： Christophe MATHIEU ,  Bertrand HOVEMAN

IPC: G06K19/077

Abstract: The invention concerns a method for producing a flexible circuit for a chip card module. The invention consists of using conductive pads located on the same face of the module as the contacts intended to establish a connection with a card reader, in order to produce an electrical connection between an antenna and an electronic chip. The connections with conductive pads are located partly inside an encapsulation area and partly outside said encapsulation area and respectively to either side of same. The invention also relates to a flexible circuit for implementing this method.