公开(公告)号：US20240402773A1

公开(公告)日：2024-12-05

申请号：US18800575

申请日：2024-08-12

Applicant: MAGIC LEAP, INC.

Inventor： Guillermo Padin Rohena ,  Adam Carl Wright ,  William Chow ,  Gary Quartana, Jr. ,  Humberto Eduardo Garcia ,  Jose Felix Rodriguez ,  Matthew Thomas Hull ,  Paul Daniel Lindquist

IPC: G06F1/20 ,  G05B15/02 ,  H02H1/00 ,  H02H5/04 ,  H05K7/20

Abstract: Various embodiments relate to a thermal management system for an electronic device, such as an augmented reality or virtual reality device. The thermal management system can comprise an active cooling mechanism in various embodiments to dynamically or actively cool components of the device, for example, by adjust fan speeds of a fan assembly. In some embodiments, a hardware shutdown mechanism can be provided to shut down the device if software-based thermal management devices are inoperable. In some embodiments, the air flow into and/or within the electronic device can be adjusted to cool various components of the device.

公开(公告)号：US12099386B2

公开(公告)日：2024-09-24

申请号：US16519716

申请日：2019-07-23

Applicant: MAGIC LEAP, INC.

Inventor： Guillermo Padin Rohena ,  Adam Carl Wright ,  William Chow ,  Gary Quartana, Jr. ,  Humberto Eduardo Garcia ,  Jose Felix Rodriguez ,  Matthew Thomas Hull ,  Paul Daniel Lindquist

IPC: G06F1/20 ,  G05B15/02 ,  H02H1/00 ,  H02H5/04 ,  H05K7/20

CPC classification number: G06F1/206 ,  G05B15/02 ,  G06F1/203 ,  H02H1/0007 ,  H02H5/04 ,  H05K7/20172 ,  H05K7/20209

Abstract: Various embodiments relate to a thermal management system for an electronic device, such as an augmented reality or virtual reality device. The thermal management system can comprise an active cooling mechanism in various embodiments to dynamically or actively cool components of the device, for example, by adjust fan speeds of a fan assembly. In some embodiments, a hardware shutdown mechanism can be provided to shut down the device if software-based thermal management devices are inoperable. In some embodiments, the air flow into and/or within the electronic device can be adjusted to cool various components of the device.

公开(公告)号：US20200033921A1

公开(公告)日：2020-01-30

申请号：US16519716

申请日：2019-07-23

Applicant: MAGIC LEAP, INC.

Inventor： Guillermo Padin Rohena ,  Adam Carl Wright ,  William Chow ,  Gary Quartana, JR. ,  Humberto Eduardo Garcia ,  Jose Felix Rodriguez ,  Matthew Thomas Hull ,  Paul Daniel Lindquist

IPC: G06F1/20 ,  H02H1/00 ,  H02H5/04 ,  H05K7/20 ,  G05B15/02

Abstract: Various embodiments relate to a thermal management system for an electronic device, such as an augmented reality or virtual reality device. The thermal management system can comprise an active cooling mechanism in various embodiments to dynamically or actively cool components of the device, for example, by adjust fan speeds of a fan assembly. In some embodiments, a hardware shutdown mechanism can be provided to shut down the device if software-based thermal management devices are inoperable. In some embodiments, the air flow into and/or within the electronic device can be adjusted to cool various components of the device.