公开(公告)号：US09476398B2

公开(公告)日：2016-10-25

申请号：US14290026

申请日：2014-05-29

Applicant: MAGNA ELECTRONICS INC.

Inventor： Ralf Biegert

IPC: H02H5/04 ,  F02P19/02 ,  F02B3/06 ,  H01H37/76 ,  B23K1/018 ,  H05K13/04 ,  H01H9/16

CPC classification number: F02P19/027 ,  B23K1/018 ,  F02B3/06 ,  H01H9/167 ,  H01H37/761 ,  H01H2037/762 ,  H01H2037/763 ,  H02H5/047 ,  H05K13/0486 ,  H05K2201/10636

Abstract: A control device suitable for use in a vehicle includes a circuit board and a spring element. The circuit board includes a circuit element electrically connected thereat. The spring element is engaged with the circuit element and biased or urged towards the circuit element to exert a force at the circuit element in a direction generally parallel to a surface of the circuit board. The circuit element is electrically connected at the circuit board via a solder joint. When a temperature at the solder joint exceeds a threshold temperature, the spring element moves the circuit element along the surface of the circuit board to break the electrical connection at the solder joint.

Abstract translation: 适用于车辆的控制装置包括电路板和弹簧元件。 电路板包括与其电连接的电路元件。 弹簧元件与电路元件接合并被偏压或被推向电路元件，以在电路元件上大致平行于电路板的表面的方向施加力。 电路元件通过焊接点电连接在电路板上。 当焊点处的温度超过阈值温度时，弹簧元件沿着电路板的表面移动电路元件以破坏焊点处的电连接。

公开(公告)号：US20140355162A1

公开(公告)日：2014-12-04

申请号：US14290026

申请日：2014-05-29

Applicant: MAGNA ELECTRONICS INC.

Inventor： Ralf Biegert

IPC: F02P19/02 ,  H02H5/04 ,  F02B3/06

CPC classification number: F02P19/027 ,  B23K1/018 ,  F02B3/06 ,  H01H9/167 ,  H01H37/761 ,  H01H2037/762 ,  H01H2037/763 ,  H02H5/047 ,  H05K13/0486 ,  H05K2201/10636

Abstract: A control device suitable for use in a vehicle includes a circuit board and a spring element. The circuit board includes a circuit element electrically connected thereat. The spring element is engaged with the circuit element and biased or urged towards the circuit element to exert a force at the circuit element in a direction generally parallel to a surface of the circuit board. The circuit element is electrically connected at the circuit board via a solder joint. When a temperature at the solder joint exceeds a threshold temperature, the spring element moves the circuit element along the surface of the circuit board to break the electrical connection at the solder joint.

Abstract translation: 适用于车辆的控制装置包括电路板和弹簧元件。 电路板包括与其电连接的电路元件。 弹簧元件与电路元件接合并被偏压或被推向电路元件，以在电路元件上大致平行于电路板的表面的方向施加力。 电路元件通过焊接点电连接在电路板上。 当焊点处的温度超过阈值温度时，弹簧元件沿着电路板的表面移动电路元件以破坏焊点处的电连接。