公开(公告)号：US20150318597A1

公开(公告)日：2015-11-05

申请号：US14699465

申请日：2015-04-29

Applicant: MANDO CORPORATION

Inventor： Jong Gyu PARK ,  Han Yeol YU

IPC: H01P5/107 ,  H01P11/00 ,  H01P1/04

CPC classification number: H01P3/121 ,  H01P3/08 ,  H01P5/028 ,  H01P11/002 ,  H01P11/003 ,  H01Q1/38 ,  H05K1/0242 ,  H05K1/144 ,  H05K2201/037 ,  H05K2201/042 ,  H05K2203/041 ,  Y10T29/49018

Abstract: The present invention relates to a multi-layer substrate which can be used in a wireless signal transmission/reception apparatus, etc, a through-hole and a first waveguide and a second waveguide which are formed by conductive films enclosing the inner surface of the through-hole are formed on an upper substrate and a lower substrate of the multi-layer substrate, respectively, and an RF signal can be transmitted between an upper surface and a lower surface through the two waveguides. A process of manufacturing a multi-layer substrate by a Surface Mount Technology (SMT) is used, so that a waveguide passing through the multi-layer substrate can be precisely and easily formed.

Abstract translation: 本发明涉及可用于无线信号发送/接收装置等的多层基板，通孔和第一波导和第二波导，该导电膜包围通孔的内表面 分别形成在多层基板的上基板和下基板上，并且可以通过两个波导在上表面和下表面之间传输RF信号。 使用通过表面贴装技术（SMT）制造多层基板的工艺，使得能够精确且容易地形成通过多层基板的波导管。