SOLAR CELL WAFER WIRE BONDING SYSTEM AND METHOD

    公开(公告)号:US20220190190A1

    公开(公告)日:2022-06-16

    申请号:US17487623

    申请日:2021-09-28

    Abstract: A wire bonding system attaches wires to a solar cell wafer. The wire bonding system includes a feed tube through which a wire is drawn. Rollers contact the wire through openings in the feed tube to facilitate movement of the wire. The wire bonding system includes a soldering heater tip and a wire cutter. The solar cell wafer is placed on a platform, which moves the solar cell wafer. The system has multiple lanes for attaching multiple wires to the solar cell wafer at the same time in parallel operations.

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