公开(公告)号：US10410962B2

公开(公告)日：2019-09-10

申请号：US15108861

申请日：2015-01-06

Applicant: MC10, Inc.

Inventor： Nicholas McMahon ,  Xianyan Wang ,  Brian Elolampi ,  Bryan D. Keen ,  David G. Garlock

IPC: H01H13/86 ,  H01L21/02 ,  H01L21/48 ,  H01L21/56 ,  H01L21/66 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538

Abstract: Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) sensor systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal integrated circuit device is disclosed which includes a flexible substrate with electronic circuitry attached to the flexible substrate. A flexible encapsulation layer is attached to the flexible substrate. The flexible encapsulation layer encases the electronic circuitry between the flexible substrate and the encapsulation layer. For some configurations, the encapsulation layer and flexible substrate arc fabricated from stretchable and bendable non-conductive polymers. The electronic circuitry may comprise an integrated circuit sensor system with multiple device islands that are electrically and physically connected via a plurality of stretchable electrical interconnects.