公开(公告)号：US20170167033A1

公开(公告)日：2017-06-15

申请号：US15323856

申请日：2015-06-05

Applicant: MEC COMPANY LTD.

Inventor： Yoichi SENGOKU ,  Mina RAIJO ,  Daisaku AKIYAMA

IPC: C23F1/28

CPC classification number: C23F1/28

Abstract: Disclosed is an etching agent for steel. The etching agent is an acidic aqueous solution including ferrous ions, ferric ions, and an acetylene group-containing water-soluble compound. The concentration of ferrous ion A % by weight and the concentration of ferric ion B % by weight in the etching agent is preferably from 0.1 to 2.5. Also disclosed is a replenishing liquid that is added to the etching agent when the etching agent is continuously or repeatedly used. The replenishing liquid is an aqueous solution including an acetylene group-containing water-soluble compound.

公开(公告)号：US20230407486A1

公开(公告)日：2023-12-21

申请号：US18036313

申请日：2021-09-30

Applicant: MEC COMPANY LTD.

Inventor： Yu FUKUI ,  Daisaku AKIYAMA ,  Dai NAKANE ,  Kenji NISHIE

IPC: C23F1/18 ,  C23F11/12 ,  C23F11/14 ,  H05K3/06

CPC classification number: C23F1/18 ,  C23F11/12 ,  C23F11/14 ,  H05K3/06

Abstract: The present invention includes an etching agent that selectively etches a copper layer of a processing target in which a noble metal layer containing a metal nobler than copper and the copper layer coexist, the etching agent including: a copper ion; one or more nitrogen-containing compounds selected from the group consisting of a heterocyclic compound having two or more nitrogen atoms in a ring and an amino group-containing compound having 8 or less carbon atoms; a polyalkylene glycol; and a halogen ion, in which the polyalkylene glycol is contained in an amount of 0.0005% by weight or more and 7% by weight or less, and the halogen ion is contained in an amount of 1 ppm or more and 250 ppm or less.

公开(公告)号：US20200040460A1

公开(公告)日：2020-02-06

申请号：US16471126

申请日：2017-12-15

Applicant: MEC COMPANY LTD.

Inventor： Daisaku AKIYAMA ,  Itsuro TOMATSU ,  Yasutaka AMITANI ,  Keisuke JOKO ,  Tokuya SATOMI

IPC: C23C22/05 ,  C08J5/12 ,  B32B15/08 ,  B32B15/20 ,  B32B37/12 ,  C23C22/82

Abstract: The coating film-forming composition is a solution of pH 4 to 10 and includes an aromatic compound having an amino group and an aromatic ring in one molecule, a polybasic acid having two or more carboxy groups, and an oxidizing agent. As the oxidizing agent, hypochlorous acid, chlorous acid, chloric acid, perchloric acid, persulfuric acid, percarbonic acid, hydrogen peroxide, organic peroxides, or the like is used. The aromatic compound preferably contains a nitrogen-containing aromatic ring, and more preferably contains a primary amino group or a secondary amino group. The coating film-forming composition is used for, for example, forming a coating film on surface of a metal member.

公开(公告)号：US20190127606A1

公开(公告)日：2019-05-02

申请号：US16096827

申请日：2017-03-13

Applicant: MEC COMPANY LTD.

Inventor： Daisaku AKIYAMA ,  Yoichi SENGOKU ,  Itsuro TOMATSU ,  Masao OKADA ,  Ryoko MITANI ,  Keisuke JOKO ,  Yasutaka AMITANI ,  Tokuya SATOMI ,  Masaru TAKAHASHI

IPC: C09D183/04 ,  B32B15/08 ,  C09J11/08 ,  C09D7/63 ,  C09J183/04

CPC classification number: C09D183/04 ,  B32B15/08 ,  B32B2255/06 ,  B32B2255/24 ,  C08K3/16 ,  C08K5/092 ,  C08K5/17 ,  C09D5/00 ,  C09D5/002 ,  C09D7/40 ,  C09D7/61 ,  C09D7/63 ,  C09D177/00 ,  C09J11/04 ,  C09J11/06 ,  C09J11/08 ,  C09J183/04 ,  C23C26/00 ,  H05K3/38

Abstract: The coating film-forming composition is a solution of pH 6 to 9 and includes an aromatic compound having an amino group and an aromatic ring in one molecule, a polybasic acid having two or more carboxy groups, and a halide ion. The content of polybasic acid in the coating film-forming composition is 0.05 to 10 times the content of aromatic compound, and the halide ion concentration is 5 to 600 mM. A coating film with excellent adhesion to a resin can be formed on a surface of a metal member by bringing the coating film-forming composition into contact with the surface of the metal member.

公开(公告)号：US20170268112A1

公开(公告)日：2017-09-21

申请号：US15531764

申请日：2015-09-17

Applicant: MEC COMPANY LTD.

Inventor： Daisaku AKIYAMA ,  Mina RAIJO

IPC: C23F1/22 ,  B29C45/14 ,  B29C45/02

CPC classification number: C23F1/22 ,  B29C45/02 ,  B29C45/14 ,  B29C45/14311 ,  B29K2705/00

Abstract: The etching agent is an aqueous solution including at least one acid selected from the group consisting of inorganic acids other than nitric acid, and organic acids; and an organic nitrogen compound having a molecular structure containing N—OH or N—O−. The acid concentration of the etching agent is 0.05 to 3% by weight, and the organic nitrogen compound concentration of the etching agent is 0.005 to 5% by weight. By bringing the etching agent into contact with a surface of a magnesium component, fine irregularities can be formed on the surface of the magnesium component even when etching depth is large.