公开(公告)号：US20150373829A1

公开(公告)日：2015-12-24

申请号：US14649204

申请日：2014-01-14

Applicant: MEIKO ELECTRONICS CO., LTD.

Inventor： Akihiro Ishikawa ,  Toru Yamamoto ,  Kazuya Inokuchi

IPC: H05K1/02

CPC classification number: H05K1/028 ,  H05K1/024 ,  H05K1/025 ,  H05K1/0278 ,  H05K1/0281 ,  H05K3/0044 ,  H05K3/282 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2203/0207 ,  H05K2203/0228

Abstract: A printed wiring board includes: an inner layer structure body containing at least an inner layer insulative base material composed of a glass cloth and resin which covers the glass cloth and not containing a resin insulative base material composed only of resin; outer layer wiring formed on a first face of the inner layer structure body; and a solder resist layer formed on a surface of the outer layer wiring, wherein in the inner layer structure body, an opening part is formed, and the solder resist layer is composed of a first ink part covering at least the outer layer wiring that is formed on a partial region of the first face which corresponds to the opening part and a second ink part interposing both ends of the first ink part and being lower in flexibility than the first ink part.

Abstract translation: 印刷电路板包括：内层结构体，至少包含由玻璃布构成的内层绝缘基材和覆盖玻璃布的树脂，不含仅由树脂构成的树脂绝缘基材; 形成在所述内层结构体的第一面上的外层布线; 以及形成在所述外层布线的表面上的阻焊层，其中在所述内层结构体中形成有开口部，所述阻焊层由至少覆盖外层布线的第一墨部构成， 形成在与开口部相对应的第一面的部分区域上，以及插入第一墨部的两端并且柔性比第一墨部低的第二墨部。

公开(公告)号：US09326376B2

公开(公告)日：2016-04-26

申请号：US14649204

申请日：2014-01-14

Applicant: MEIKO ELECTRONICS CO., LTD.

Inventor： Akihiro Ishikawa ,  Toru Yamamoto ,  Kazuya Inokuchi

IPC: H05K1/00 ,  H05K1/02

CPC classification number: H05K1/028 ,  H05K1/024 ,  H05K1/025 ,  H05K1/0278 ,  H05K1/0281 ,  H05K3/0044 ,  H05K3/282 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2203/0207 ,  H05K2203/0228

Abstract: A printed wiring board includes: an inner layer structure body containing at least an inner layer insulative base material composed of a glass cloth and resin which covers the glass cloth and not containing a resin insulative base material composed only of resin; outer layer wiring formed on a first face of the inner layer structure body; and a solder resist layer formed on a surface of the outer layer wiring, wherein in the inner layer structure body, an opening part is formed, and the solder resist layer is composed of a first ink part covering at least the outer layer wiring that is formed on a partial region of the first face which corresponds to the opening part and a second ink part interposing both ends of the first ink part and being lower in flexibility than the first ink part.

Abstract translation: 印刷电路板包括：内层结构体，至少包含由玻璃布构成的内层绝缘基材和覆盖玻璃布的树脂，不含仅由树脂构成的树脂绝缘基材; 形成在所述内层结构体的第一面上的外层布线; 以及形成在所述外层布线的表面上的阻焊层，其中在所述内层结构体中形成有开口部，所述阻焊层由至少覆盖外层布线的第一墨部构成， 形成在与开口部相对应的第一面的部分区域上，以及插入第一墨部的两端并且柔性比第一墨部低的第二墨部。