公开(公告)号：US20210311140A1

公开(公告)日：2021-10-07

申请号：US17351748

申请日：2021-06-18

Applicant: MELEXIS TECHNOLOGIES NV ,  X-CELEPRINT LIMITED

Inventor： Christian SCHOTT ,  Matthew MEITL ,  Christopher BOWER

IPC: G01R33/09 ,  G01R33/00 ,  G01R33/07

Abstract: A multi-element sensor for measuring a magnetic field. The multi-element sensor comprises a magnetic sensing element, and an electronic circuit. The magnetic sensing element comprises a sensor substrate and a magnetic sensor. The magnetic sensing element is mounted on the electronic circuit and contact pads are provided on the magnetic sensor. The contact pads of the magnetic sensing element are electrically connected with the electronic circuit. The electronic circuit is produced in a first technology and/or first material and the magnetic sensing element is produced in a second technology and/or second material different from the first technology/material, and the contact pads are disposed next to an edge or at a corner of the sensor substrate.

公开(公告)号：US20180100902A1

公开(公告)日：2018-04-12

申请号：US15829223

申请日：2017-12-01

Applicant: MELEXIS TECHNOLOGIES NV ,  X-CELEPRINT LIMITED

Inventor： Christian SCHOTT ,  Matthew MEITL ,  Christopher BOWER

IPC: G01R33/00 ,  G01R33/07 ,  G01R33/09

CPC classification number: G01R33/0047 ,  G01R15/207 ,  G01R33/0052 ,  G01R33/0094 ,  G01R33/07 ,  G01R33/077 ,  G01R33/09 ,  G01R33/093 ,  G01R33/098 ,  H01L24/00 ,  H01L24/24 ,  H01L24/82 ,  H01L24/94 ,  H01L43/04 ,  H01L2224/24146 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/83005 ,  H01L2224/92137 ,  H01L2224/92244 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/82 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A multi-element sensor for measuring a magnetic field. The multi-element sensor comprises a magnetic sensing element, and an electronic circuit. The magnetic sensing element is mounted on the electronic circuit and comprises a fractured tether. The magnetic sensing element is electrically connected with the electronic circuit. The electronic circuit is produced in a first technology and/or first material and the magnetic sensing element is produced in a second technology and/or second material different from the first technology/material.

公开(公告)号：US20170328962A1

公开(公告)日：2017-11-16

申请号：US15524003

申请日：2015-11-03

Applicant: MELEXIS TECHNOLOGIES NV ,  X-CELEPRINT LIMITED

Inventor： Christian SCHOTT ,  Matthew MEITL ,  Christopher BOWER

IPC: G01R33/07 ,  G01R33/00

CPC classification number: G01R33/07 ,  G01R33/0052 ,  G01R33/077 ,  H01L24/24 ,  H01L24/82 ,  H01L24/94 ,  H01L43/04 ,  H01L2224/24146 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/83005 ,  H01L2224/92137 ,  H01L2224/92244 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/82 ,  H01L2224/83

Abstract: A semiconductor chip for measuring a magnetic field. The semiconductor chip comprises a magnetic sensing element, and an electronic circuit. The magnetic sensing element is mounted on the electronic circuit. The magnetic sensing element is electrically connected with the electronic circuit. The electronic circuit is produced in a first technology and/or first material and the magnetic sensing element is produced in a second technology and/or second material different from the first technology/material.

公开(公告)号：US20220199606A1

公开(公告)日：2022-06-23

申请号：US17690952

申请日：2022-03-09

Applicant: The Board of Trustees of the University of Illinois ,  X-CELEPRINT LIMITED

Inventor： John A. ROGERS ,  Ralph NUZZO ,  Matthew MEITL ,  Etienne MENARD ,  Alfred BACA ,  Michael MOTALA ,  Jong-Hyun AHN ,  Sang-Il PARK ,  Chang-Jae YU ,  Heung Cho KO ,  Mark STOYKOVICH ,  Jongseung YOON

IPC: H01L25/00 ,  H01L27/12 ,  H01L21/00 ,  H01L31/0725 ,  H01L31/18 ,  H01S5/42 ,  H01L25/075 ,  H01L31/054 ,  H01L33/58 ,  H01L33/00 ,  H01S5/02251 ,  H01L31/0525 ,  H01L25/16 ,  H01L33/54 ,  H01L33/56 ,  H01L25/04 ,  H01L31/043 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/0288 ,  H01L31/0693 ,  H01L31/167 ,  H01L33/06 ,  H01L33/30 ,  H01L33/48 ,  H01L33/62 ,  H01S5/02 ,  H01S5/343 ,  H01L27/146 ,  H01L31/02 ,  H01L31/0304 ,  H01L33/52 ,  H01S5/183 ,  H01S5/30

Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.

公开(公告)号：US20200161291A1

公开(公告)日：2020-05-21

申请号：US16667215

申请日：2019-10-29

Applicant: The Board of Trustees of the University of Illinois ,  X-CELEPRINT LIMITED

Inventor： John A. ROGERS ,  Ralph NUZZO ,  Matthew MEITL ,  Etienne MENARD ,  Alfred BACA ,  Michael MOTALA ,  Jong-Hyun AHN ,  Sang-Il PARK ,  Chang-Jae YU ,  Heung Cho KO ,  Mark STOYKOVICH ,  Jongseung YOON

IPC: H01L25/00 ,  H01S5/30 ,  H01S5/183 ,  H01S5/022 ,  H01L33/52 ,  H01L31/0304 ,  H01L31/0232 ,  H01L31/02 ,  H01L27/146 ,  H01S5/343 ,  H01S5/02 ,  H01L33/62 ,  H01L33/48 ,  H01L33/30 ,  H01L33/06 ,  H01L33/00 ,  H01L31/18 ,  H01L31/167 ,  H01L31/0693 ,  H01L31/0288 ,  H01L31/0216 ,  H01L27/12 ,  H01L31/043 ,  H01L25/04 ,  H01L33/56 ,  H01L33/54 ,  H01L25/16 ,  H01L31/0525 ,  H01L33/58 ,  H01L31/054 ,  H01L25/075 ,  H01S5/42 ,  H01L31/0725 ,  H01L21/00

Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.