公开(公告)号：US20160053384A1

公开(公告)日：2016-02-25

申请号：US14783370

申请日：2014-03-31

Applicant: MITSUBISHI GAS CHEMICALCOMPANY, INC.

Inventor： Tomoyuki ADANIYA ,  Kunio YUBE ,  Satoshi TAMAI

IPC: C23F1/26 ,  H05K3/06 ,  H05K1/09 ,  C23F1/18 ,  H05K1/02

CPC classification number: C23F1/26 ,  C23F1/02 ,  C23F1/18 ,  C23F1/44 ,  H01L21/32134 ,  H05K1/0298 ,  H05K1/09 ,  H05K3/061 ,  H05K3/067 ,  H05K2201/0338

Abstract: The present invention provides a liquid composition used for etching a copper- and titanium-containing multilayer film, a method for etching a copper- and titanium-containing multilayer film by using said liquid composition, a method for manufacturing multilayer-film wiring according to said etching method, and a substrate provided with multilayer-film wiring manufactured according to said manufacturing method. According to the present invention, a liquid composition comprising (A) a maleic acid ion source, (B) a copper ion source and (C) a fluoride ion source and having the pH value of 0-7 is used.

Abstract translation: 本发明提供了一种用于蚀刻含铜和钛的多层膜的液体组合物，通过使用所述液体组合物来蚀刻含铜和钛的多层膜的方法，根据所述的方法制造多层膜布线 蚀刻方法和具有根据所述制造方法制造的多层膜布线的基板。 根据本发明，使用包含（A）马来酸离子源，（B）铜离子源和（C）氟离子源并具有0-7的pH值的液体组合物。