公开(公告)号：US20110286193A1

公开(公告)日：2011-11-24

申请号：US13112049

申请日：2011-05-20

Applicant: Marc DUARTE ,  Benjamin THIERRY ,  Benjamin TOUZET

Inventor： Marc DUARTE ,  Benjamin THIERRY ,  Benjamin TOUZET

IPC: H05K1/14

CPC classification number: H05K1/147 ,  H05K3/363 ,  H05K2201/09481 ,  H05K2201/10106 ,  H05K2201/10318

Abstract: An assembly of at least two electric boards, and in particular two printed circuit boards, the two boards being welded to one another, wherein at least one of the two boards comprises at least one orifice which shows a trace of the welding.

Abstract translation: 至少两个电板的组件，特别是两个印刷电路板，两个板彼此焊接在一起，其中两个板中的至少一个包括至少一个显示焊接痕迹的孔。