公开(公告)号：US20230268236A1

公开(公告)日：2023-08-24

申请号：US18041318

申请日：2021-08-13

Applicant: Massachusetts Institute of Technology

Inventor： Dane William DEQUILETTES ,  Brandon T. MOTES ,  Anthony T. TROUPE ,  Vladimir BULOVIC

IPC: H01L21/66

CPC classification number: H01L22/26

Abstract: An example methodology implementing the disclosed techniques includes receiving a plurality of measured semiconductor properties of one or more partially completed semiconductor devices, determining a measure of short circuit current density (JSC) of each of the one or more partially completed semiconductor devices, the JSC, measure based on a measure of semiconductor diffusion length (LD) and a measure of thickness, and determining a current voltage relationship of each of the one or more partially completed semiconductor devices. The method also includes calculating a current voltage (JV) curve based on the JSC, measure and the current voltage relationship of each of the one or more partially completed semiconductor devices, wherein the JV curve provides an indication of maximum achievable power point (Pmax) and open circuit voltage (Voc) of a semiconductor device completed from the one or more partially completed semiconductor devices, and determining a predicted performance characteristic of the semiconductor device.

公开(公告)号：US20230304944A1

公开(公告)日：2023-09-28

申请号：US18041279

申请日：2021-08-13

Applicant: Massachusetts Institute of Technology

Inventor： Anthony T. TROUPE ,  Brandon T. MOTES ,  Dane William DEQUILETTES ,  Vladimir BULOVIC

IPC: G01N21/95

CPC classification number: G01N21/9501 ,  G01N2201/06113

Abstract: Described are devices and methods for measuring semiconductor materials, devices, circuits, and systems. The device includes a probe head that accepts multiple optical assemblies. At least one optical assembly provides a light source, and at least one optical assembly provides a detector. Both are coupled to the probe head. The optical assemblies may be manually or automatically adjustable using kinematic mounts, and may include optical fibers for conveying light to and from a sample. Each optical assembly may include a lens stack or an objective. Illumination and collection assemblies may share a common focal point, and different subsets of assemblies may share different focal points. The device may include a sample bed for imaging multiple samples at once, and may be coupled to a control system for automatically positioning the samples and/or the optical assemblies.