Metallization and stringing for back-contact solar cells

    公开(公告)号:US11973157B2

    公开(公告)日:2024-04-30

    申请号:US17980440

    申请日:2022-11-03

    Inventor: Akira Terao

    CPC classification number: H01L31/0504 H01L31/022441 Y02E10/50

    Abstract: Metallization and stringing methods for back-contact solar cells, and resulting solar cells, are described. In an example, in one embodiment, a method involves aligning conductive wires over the back sides of adjacent solar cells, wherein the wires are aligned substantially parallel to P-type and N-type doped diffusion regions of the solar cells. The method involves bonding the wires to the back side of each of the solar cells over the P-type and N-type doped diffusion regions. The method further includes cutting every other one of the wires between each adjacent pair of the solar cells.

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