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公开(公告)号：US20250040261A1
公开(公告)日：2025-01-30
申请号：US18226479
申请日：2023-07-26
Applicant: Maxeon Solar Pte. Ltd.
Inventor： Chin Yeung WONG , Hui Khim CHO , Jeevan SIVARAMAN , Renante REFAMONTE
IPC: H01L31/05 , H01L31/044 , H01L31/068 , H01L31/18
Abstract: A solar cell module with interconnect wires wire-bonded to back-contact solar cells. A solar cell module using an interconnect board to electrical interconnect back-contact solar cells. The interconnect board may also contain a bypass diode and circuitry to connect the bypass diode to solar cells of the module.
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