-
公开(公告)号：US12201825B2
公开(公告)日：2025-01-21
申请号：US16936092
申请日：2020-07-22
Applicant: Medtronic, Inc.
Inventor： Reginald D. Robinson , Mary E. Robischon , Rodney J. Haberle , Gerald G. Lindner , Don A. Rutledge , Jason R. Simoneau
Abstract: An implantable medical device assembly comprises a sealed housing; a motor including a rotating output shaft within the sealed housing; a first coaxial shaft within the sealed housing, the first coaxial shaft being mechanically coupled to the rotating output shaft such that rotation of the rotating output shaft drives rotation of the first coaxial shaft; a second coaxial shaft external to the sealed housing, the second coaxial shaft being in axial alignment with the first coaxial shaft; an oscillating component mechanically coupling the first coaxial shaft to the second coaxial shaft, wherein rotation of the rotating first coaxial shaft drives the oscillation of the oscillating component, wherein the oscillation of the oscillating component drives rotation of the second coaxial shaft; and a flexible seal including the oscillating component. The sealed housing and the flexible seal combine to form a substantially sealed enclosure encasing the motor and the first coaxial shaft.
-
公开(公告)号：US11672969B2
公开(公告)日：2023-06-13
申请号：US16947954
申请日：2020-08-25
Applicant: Medtronic, Inc.
Inventor： Anthony M. Chasensky , Bernard Q. Li , Brad C. Tischendorf , Chris J. Paidosh , Christian S. Nielsen , Craig L. Schmidt , David A. Dinsmoor , Duane L. Bourget , Eric H. Bonde , Erik R. Scott , Forrest C M Pape , Gabriela C. Molnar , Gordon O. Munns , Joel A. Anderson , John E. Kast , Joseph J. Viavattine , Markus W. Reiterer , Michael J. Ebert , Phillip C. Falkner , Prabhakar A. Tamirisa , Randy S. Roles , Reginald D. Robinson , Richard T. Stone , Shawn C. Kelley , Stephen J. Roddy , Thomas P. Miltich , Timothy J. Denison , Todd V. Smith , Xuan K. Wei
CPC classification number: A61N1/02 , A61B17/00234 , A61N1/05 , A61N1/0551 , A61N1/3605 , A61N1/36007 , A61N1/36057 , A61N1/36067 , A61N1/36071 , A61N1/36139 , A61N1/3727 , A61N1/3754 , A61N1/3756 , A61N1/3787 , A61N1/37205 , A61N1/37223 , A61N1/37235 , A61N1/37247 , A61N1/36021 , A61N1/36053 , A61N1/37211 , A61N1/37518 , F04C2270/0421
Abstract: A medical device system for delivering a neuromodulation therapy includes a delivery tool for deploying an implantable medical device at a neuromodulation therapy site. The implantable medical device includes a housing, an electronic circuit within the housing, and an electrical lead comprising a lead body extending between a proximal end coupled to the housing and a distal end extending away from the housing and at least one electrode carried by the lead body. The delivery tool includes a first cavity for receiving the housing and a second cavity for receiving the lead. The first cavity and the second cavity are in direct communication for receiving and deploying the housing and the lead coupled to the housing concomitantly as a single unit.
-
公开(公告)号：US20200376255A1
公开(公告)日：2020-12-03
申请号：US16947944
申请日：2020-08-25
Applicant: Medtronic, Inc.
Inventor： Brad C. Tischendorf , John E. Kast , Thomas P. Miltich , Gordon O. Munns , Randy S. Roles , Craig L. Schmidt , Joseph J. Viavattine , Christian S. Nielsen , Prabhakar A. Tamirisa , Anthony M. Chasensky , Markus W. Reiterer , Chris J. Paidosh , Reginald D. Robinson , Bernard Q. Li , Erik R. Scott , Phillip C. Falkner , Xuan K. Wei , Eric H. Bonde , David A. Dinsmoor , Duane L. Bourget , Forrest C M Pape , Gabriela C. Molnar , Joel A. Anderson , Michael J. Ebert , Richard T. Stone , Shawn C. Kelley , Stephen J. Roddy , Timothy J. Denison , Todd V. Smith
Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.
-
公开(公告)号：US11730947B2
公开(公告)日：2023-08-22
申请号：US16947945
申请日：2020-08-25
Applicant: Medtronic, Inc.
Inventor： Brad C. Tischendorf , John E. Kast , Thomas P. Miltich , Gordon O. Munns , Randy S. Roles , Craig L. Schmidt , Joseph J. Viavattine , Christian S. Nielsen , Prabhakar A. Tamirisa , Anthony M. Chasensky , Markus W. Reiterer , Chris J. Paidosh , Reginald D. Robinson , Bernard Q. Li , Erik R. Scott , Phillip C. Falkner , Xuan K. Wei , Eric H. Bonde
CPC classification number: A61N1/02 , A61B17/00234 , A61N1/05 , A61N1/0551 , A61N1/3605 , A61N1/36007 , A61N1/36057 , A61N1/36067 , A61N1/36071 , A61N1/36139 , A61N1/3727 , A61N1/3754 , A61N1/3756 , A61N1/3787 , A61N1/37205 , A61N1/37223 , A61N1/37235 , A61N1/37247 , A61N1/36021 , A61N1/36053 , A61N1/37211 , A61N1/37518 , F04C2270/0421
Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.
-
公开(公告)号：US20200376257A1
公开(公告)日：2020-12-03
申请号：US16947948
申请日：2020-08-25
Applicant: Medtronic, Inc.
Inventor： Anthony M. Chasensky , Bernard Q. Li , Brad C. Tischendorf , Chris J. Paidosh , Christian S. Nielsen , Craig L. Schmidt , Eric H. Bonde , Erik R. Scott , Gabriela C. Molnar , Gordon O. Munns , John E. Kast , Joseph J. Viavattine , Markus W. Reiterer , Michael J. Ebert , Phillip C. Falkner , Prabhakar A. Tamirisa , Randy S. Roles , Reginald D. Robinson , Richard T. Stone , Shawn C. Kelley , Thomas P. Miltich , Todd V. Smith , Xuan K. Wei
Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.
-
Patent Agency Ranking
公开(公告)号：US20190126028A1
公开(公告)日：2019-05-02
申请号：US16232724
申请日：2018-12-26
Applicant: Medtronic, Inc.
Inventor： Brad C. Tischendorf , John E. Kast , Thomas P. Miltich , Gordon O. Munns , Randy S. Roles , Craig L. Schmidt , Joseph J. Viavattine , Christian S. Nielsen , Prabhakar A. Tamirisa , Anthony M. Chasensky , Markus W. Reiterer , Chris J. Paidosh , Reginald D. Robinson , Bernard Q. Li , Erik R. Scott , Phillip C. Falkner , Xuan K. Wei , Eric H. Bonde
Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer seal is positioned in the joint in various embodiments. Other embodiments of an IMD housing are disclosed.
-
公开(公告)号：US10201335B2
公开(公告)日：2019-02-12
申请号：US15218855
申请日：2016-07-25
Applicant: Medtronic, Inc.
Inventor： Brad C. Tischendorf , John E. Kast , Thomas P. Miltich , Gordon O. Munns , Randy S. Roles , Craig L. Schmidt , Joseph J. Viavattine , Christian S. Nielsen , Prabhakar A. Tamirisa , Anthony M. Chasensky , Markus W. Reiterer , Chris J. Paidosh , Reginald D. Robinson , Bernard Q. Li , Erik R. Scott , Phillip C. Falkner , Xuan K. Wei , Eric H. Bonde
Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer seal is positioned in the joint in various embodiments. Other embodiments of an IMD housing are disclosed.
-
公开(公告)号：US20140163646A1
公开(公告)日：2014-06-12
申请号：US14099462
申请日：2013-12-06
Applicant: Medtronic, Inc.
Inventor： Brad C. Tischendorf , John E. Kast , Thomas P. Miltich , Gordon O. Munns , Randy S. Roles , Craig L. Schmidt , Joseph J. Viavattine , Christian S. Nielsen , Prabhakar A. Tamirisa , Anthony M. Chasensky , Markus W. Reiterer , Chris J. Paidosh , Reginald D. Robinson , Bernard Q. Li , Erik R. Scott , Phillip C. Falkner , Xuan K. Wei , Eric H. Bonde
CPC classification number: A61B17/00234 , A61N1/02 , A61N1/05 , A61N1/0551 , A61N1/36 , A61N1/36007 , A61N1/36021 , A61N1/3605 , A61N1/36053 , A61N1/36057 , A61N1/36067 , A61N1/36071 , A61N1/36139 , A61N1/37205 , A61N1/37211 , A61N1/37223 , A61N1/37235 , A61N1/37247 , A61N1/37252 , A61N1/3727 , A61N1/375 , A61N1/3754 , A61N1/3756 , A61N1/3787 , F04C2270/0421
Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer enclosure member surrounds the joint and circumscribes the housing in various embodiments. Other embodiments of an IMD housing are disclosed.
Abstract translation: 可植入医疗装置（IMD）具有包围电子电路的外壳。 壳体包括第一壳体部分，第二壳体部分和将第一壳体部分联接到第二壳体部分的接合部。 在各种实施例中，聚合物外壳构件围绕接头并围绕外壳。 公开了IMD外壳的其它实施例。
-
公开(公告)号：US11793998B2
公开(公告)日：2023-10-24
申请号：US16947948
申请日：2020-08-25
Applicant: Medtronic, Inc.
Inventor： Anthony M. Chasensky , Bernard Q. Li , Brad C. Tischendorf , Chris J. Paidosh , Christian S. Nielsen , Craig L. Schmidt , Eric H. Bonde , Erik R. Scott , Gabriela C. Molnar , Gordon O. Munns , John E. Kast , Joseph J. Viavattine , Markus W. Reiterer , Michael J. Ebert , Phillip C. Falkner , Prabhakar A. Tamirisa , Randy S. Roles , Reginald D. Robinson , Richard T. Stone , Shawn C. Kelley , Thomas P. Miltich , Todd V. Smith , Xuan K. Wei
CPC classification number: A61N1/02 , A61B17/00234 , A61N1/05 , A61N1/0551 , A61N1/3605 , A61N1/36007 , A61N1/36057 , A61N1/36067 , A61N1/36071 , A61N1/36139 , A61N1/3727 , A61N1/3754 , A61N1/3756 , A61N1/3787 , A61N1/37205 , A61N1/37223 , A61N1/37235 , A61N1/37247 , A61N1/36021 , A61N1/36053 , A61N1/37211 , A61N1/37518 , F04C2270/0421
Abstract: A neuromodulation therapy is delivered via at least one electrode implanted subcutaneously and superficially to a fascia layer superficial to a nerve of a patient. In one example, an implantable medical device is deployed along a superficial surface of a deep fascia tissue layer superficial to a nerve of a patient. Electrical stimulation energy is delivered to the nerve through the deep fascia tissue layer via implantable medical device electrodes.
-
公开(公告)号：US11617879B2
公开(公告)日：2023-04-04
申请号：US16232724
申请日：2018-12-26
Applicant: Medtronic, Inc.
Inventor： Brad C. Tischendorf , John E. Kast , Thomas P. Miltich , Gordon O. Munns , Randy S. Roles , Craig L. Schmidt , Joseph J. Viavattine , Christian S. Nielsen , Prabhakar A. Tamirisa , Anthony M. Chasensky , Markus W. Réitérer , Chris J. Paidosh , Reginald D. Robinson , Bernard Q. Li , Erik R. Scott , Phillip C. Falkner , Xuan K. Wei , Eric H. Bonde
Abstract: An implantable medical device (IMD) has a housing enclosing an electronic circuit. The housing includes a first housing portion, a second housing portion and a joint coupling the first housing portion to the second housing portion. A polymer seal is positioned in the joint in various embodiments. Other embodiments of an IMD housing are disclosed.
-
-
-
-
-
-
-
-
-
Search Results
19
records
(took 0.015 seconds)
