公开(公告)号：US20240297260A1

公开(公告)日：2024-09-05

申请号：US18534074

申请日：2023-12-08

Applicant: Melexis Technologies NV

Inventor： Rachel GLEESON ,  Luc BUYDENS

IPC: H01L31/0203 ,  H01L23/26 ,  H01L31/18

CPC classification number: H01L31/0203 ,  H01L23/26 ,  H01L31/18

Abstract: A method of manufacturing a sensor device (100) comprises forming (200) a substrate (102) comprising a sensor element followed by forming (202) a cap layer (104). The cap layer (104) is then bonded (204) to the substrate (102) before the substrate (102) is thinned (206). A via is formed (210) between the sensor element and a back side of the thinned substrate (102). An electrical connection is provided between the sensor element and the back side of the thinned substrate (102). A mask is formed (208) on the cap layer (104) to define an area about a predetermined window region (108) before forming (210) of the via. A portion of the cap layer (104) about the predetermined window region (108) of the cap layer (104) is removed (212) after formation (210) of the via.