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公开(公告)号：US20230165162A1
公开(公告)日：2023-05-25
申请号：US18058426
申请日：2022-11-23
Applicant: Melexis Technologies SA
Inventor： Brecht PUT , Tim VANGERVEN
CPC classification number: H01L43/065 , H01L23/562 , H01L23/3107
Abstract: An integrated sensor and method for manufacturing the sensor includes a first component having a first material with a predetermined first value of coefficient of thermal expansion (CTE), and a second component over the first component. The second component includes a second material with a predetermined second value of CTE different from the first value. An interlayer is provided by molecular layer deposition, for minimizing stress caused by coefficient of thermal expansion mismatch between the first and second components. The interlayer includes an organic-inorganic hybrid polymer compound.
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公开(公告)号：US20220137100A1
公开(公告)日：2022-05-05
申请号：US17515075
申请日：2021-10-29
Applicant: Melexis Technologies SA
Inventor： Lucian BARBUT , Simon HOUIS , Lionel TOMBEZ , Tim VANGERVEN
Abstract: A current sensor system has a conductor and a packaged integrated circuit for sensing a current in the conductor. The conductor is external to the packaged integrated circuit. The packaged integrated circuit includes a substrate having an active surface and a back surface; one or more magnetic sensing elements; a processing circuit arranged to process signals received from the one or more magnetic sensing elements to derive an output signal indicative of a sensed current in the conductor; a housing; a plurality of leads; electrical connections between the leads and the active surface. The back surface of the substrate is disposed on a support formed by at least two inner lead portions of the plurality of leads and the active side of the substrate is oriented towards the outer ends of the outer lead portions of the leads in a direction perpendicular to a plane defined by the support.
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公开(公告)号：US20230160927A1
公开(公告)日：2023-05-25
申请号：US18058437
申请日：2022-11-23
Applicant: Melexis Technologies SA
Inventor： Brecht PUT , Tim VANGERVEN
CPC classification number: G01R15/202 , G01R33/072 , G01R33/0052 , G01R33/0047
Abstract: A method of manufacture of a sensor and a sensor for sensing a magnetic field generated by a current in a conductive substrate includes a first substrate having a sensing element for sensing magnetic field, and a second substrate is the conductive substrate. A conformal layer is provided by atomic layer deposition between the first substrate and the second substrate, thus protecting at least the sensing element from discharge from the second substrate.
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公开(公告)号：US20200300898A1
公开(公告)日：2020-09-24
申请号：US16826869
申请日：2020-03-23
Applicant: Melexis Technologies SA
Inventor： Tim VANGERVEN , Appolonius Jacobus VAN DER WIEL
IPC: G01R19/00 , G01R15/20 , H01L21/48 , H01L21/56 , H01L21/768 , H01L23/495 , H01L23/00
Abstract: A current sensor is described comprising an integrated circuit for sensing electric currents comprising an active side, the active side comprising at least one sensing element and at least one contact pad and a housing comprising material embedding the integrated circuit arranged for allowing electric connection to the at least two contact pads of the active side of the integrated circuit. The housing comprises at least one conductive via disposed outside the integrated circuit and connected to the at least one contact pad, for distributing signals from the at least one contact pad through the housing away from the active side of the integrated circuit.
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公开(公告)号：US20250110185A1
公开(公告)日：2025-04-03
申请号：US18895705
申请日：2024-09-25
Applicant: Melexis Technologies SA
Inventor： Brecht PUT , Tim VANGERVEN
IPC: G01R31/396 , G01R31/382 , H01M10/44 , H01M50/609
Abstract: A method is for determining current flow in a battery cell during manufacturing of the battery cell is provided. The method includes arranging a contactless current sensor relatively to the battery cell, wherein the contactless current sensor comprises at least one current sensing element; performing at least one of: filling the battery cell with an electrolyte, charging the battery cell, and discharging the battery cell; and determining, by the contactless current sensor, a current flow within the battery cell during or after the at least one of the filling the battery cell with the electrolyte, the charging the battery cell, and the discharging the battery cell. Further, a contactless current sensor, and a corresponding manufacturing equipment are provided.
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Patent Agency Ranking
公开(公告)号：US20240426876A1
公开(公告)日：2024-12-26
申请号：US18750165
申请日：2024-06-21
Applicant: Melexis Technologies SA
Inventor： Brecht PUT , Tim VANGERVEN , Simon HOUIS
Abstract: A lead frame for a current sensor is provided. The frame includes a conductive piece with an average thickness, and a sensing zone for generating a signal detectable by a current sensing element when current flows through the lead frame. It also includes a routing zone outside the sensing zone for routing current towards the sensing zone. The routing zone comprises a region with the largest area having a predetermined average thickness. At least the sensing zone includes additional material disposed on the conductive piece so the total thickness of the sensing zone is thicker than the average thickness of said largest area.
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公开(公告)号：US20240003940A1
公开(公告)日：2024-01-04
申请号：US18467942
申请日：2023-09-15
Applicant: Melexis Technologies SA
Inventor： Lucian BARBUT , Simon HOUIS , Lionel TOMBEZ , Tim VANGERVEN
CPC classification number: G01R15/202 , G01R15/205 , H05K2201/10151 , H05K1/181 , H05K1/0213
Abstract: A current sensor system has a conductor and a packaged integrated circuit for sensing a current in the conductor. The conductor is external to the packaged integrated circuit. The packaged integrated circuit includes a substrate having an active surface and a back surface; one or more magnetic sensing elements; a processing circuit arranged to process signals received from the one or more magnetic sensing elements to derive an output signal indicative of a sensed current in the conductor; a housing; a plurality of leads; electrical connections between the leads and the active surface. The back surface of the substrate is disposed on a support formed by at least two inner lead portions of the plurality of leads and the active side of the substrate is oriented towards the outer ends of the outer lead portions of the leads in a direction perpendicular to a plane defined by the support.
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公开(公告)号：US20230314485A1
公开(公告)日：2023-10-05
申请号：US18327331
申请日：2023-06-01
Applicant: Melexis Technologies SA
Inventor： Tim VANGERVEN , Appolonius Jacobus VAN DER WIEL
IPC: G01R19/00 , G01R15/20 , H01L21/48 , H01L21/56 , H01L21/768 , H01L23/495 , H01L23/00
CPC classification number: G01R19/0092 , G01R15/202 , H01L21/4825 , H01L21/565 , H01L21/76898 , H01L23/4952 , H01L23/49541 , H01L24/05 , H01L24/48 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247
Abstract: A current sensor is described comprising an integrated circuit for sensing electric currents comprising an active side, the active side comprising at least one sensing element and at least one contact pad and a housing comprising material embedding the integrated circuit arranged for allowing electric connection to the at least two contact pads of the active side of the integrated circuit. The housing comprises at least one conductive via disposed outside the integrated circuit and connected to the at least one contact pad, for distributing signals from the at least one contact pad through the housing away from the active side of the integrated circuit.
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公开(公告)号：US20220412816A1
公开(公告)日：2022-12-29
申请号：US17850566
申请日：2022-06-27
Applicant: Melexis Technologies SA
Inventor： Nicolas DUPRE , Gael CLOSE , Theo LE SIGNOR , Tim VANGERVEN
Abstract: A force sensor has a sensing system including a target piece and a sensing element, configured to provide changes of a magnetic field, being generated by motion of the target piece. The sensing element senses these changes and provides a signal representative of the position of the target piece. An integrated circuit with processing means can process signals from the sensing element. A semiconductor package includes at least the integrated circuit. A flexible piece includes the target, and it is attached to the semiconductor package. The attachment area between the flexible piece and the semiconductor package does not extend beyond the top projection, or outline, of the semiconductor package. The flexible piece receives a force stimulus, so that upon exerting a force on the flexible piece, the displacement of the target piece with respect to the surface of the semiconductor package can be sensed by the sensing element.
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公开(公告)号：US20220412791A1
公开(公告)日：2022-12-29
申请号：US17850509
申请日：2022-06-27
Applicant: Melexis Technologies SA
Inventor： Gael CLOSE , Jerome DEGOIS , Nicolas DUPRE , Theo LE SIGNOR , Tim VANGERVEN
Abstract: A weight sensor comprises a sensing system including a target piece and a sensing element, configured to provide changes of a magnetic field, being generated by motion of the target piece. The sensing element senses these changes and provides a signal representative of the position of the target piece. An integrated circuit with processing means can process signals from the sensing element. The flexible piece receives a force stimulus, so that upon exerting a force on the flexible piece by a product due to the weight of said product, the displacement of the target piece with respect to sensing elements can be sensed.
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