-
公开(公告)号：US10597290B2
公开(公告)日：2020-03-24
申请号：US16409687
申请日：2019-05-10
Applicant: Memjet Technology Limited
Inventor： Angus North , Ronan O'Reilly , Gregory McAvoy
Abstract: A process for filling one or more etched holes defined in a frontside surface of a wafer substrate. The process includes the steps of: depositing a layer of a thermoplastic first polymer onto the frontside surface and into each hole until the holes are overfilled with the first polymer; depositing a layer of a photoimageable second polymer different than the first polymer; selectively removing the second polymer from regions outside a periphery of the holes; exposing the wafer substrate to a controlled oxidative plasma so as to reveal the frontside surface of the wafer substrate; and planarizing the frontside surface to provide holes filled with a plug of the first polymer only, each plug having a respective upper surface coplanar with the frontside surface.
-
公开(公告)号：US20190263657A1
公开(公告)日：2019-08-29
申请号：US16409687
申请日：2019-05-10
Applicant: Memjet Technology Limited
Inventor： Angus North , Ronan O'Reilly , Gregory McAvoy
Abstract: A process for filling one or more etched holes defined in a frontside surface of a wafer substrate. The process includes the steps of: depositing a layer of a thermoplastic first polymer onto the frontside surface and into each hole until the holes are overfilled with the first polymer; depositing a layer of a photoimageable second polymer different than the first polymer; selectively removing the second polymer from regions outside a periphery of the holes; exposing the wafer substrate to a controlled oxidative plasma so as to reveal the frontside surface of the wafer substrate; and planarizing the frontside surface to provide holes filled with a plug of the first polymer only, each plug having a respective upper surface coplanar with the frontside surface.
-
公开(公告)号：US10822228B2
公开(公告)日：2020-11-03
申请号：US16790531
申请日：2020-02-13
Applicant: Memjet Technology Limited
Inventor： Angus North , Ronan O'Reilly , Gregory McAvoy
Abstract: A process for forming inkjet nozzle devices on a frontside surface of a wafer substrate. The process includes the steps of: (i) providing the wafer substrate having a plurality of etched holes defined in the frontside surface, each etched hole being filled with first and second polymers such that the second polymer is coplanar with the frontside surface; (ii) forming the inkjet nozzle devices on the frontside surface using MEMS fabrication steps; and (iii) removing the first and second polymers via oxidative ashing, wherein first and second polymers are different.
-
公开(公告)号：US20200180949A1
公开(公告)日：2020-06-11
申请号：US16790531
申请日：2020-02-13
Applicant: Memjet Technology Limited
Inventor： Angus North , Ronan O'Reilly , Gregory McAvoy
Abstract: A process for forming inkjet nozzle devices on a frontside surface of a wafer substrate. The process includes the steps of: (i) providing the wafer substrate having a plurality of etched holes defined in the frontside surface, each etched hole being filled with first and second polymers such that the second polymer is coplanar with the frontside surface; (ii) forming the inkjet nozzle devices on the frontside surface using MEMS fabrication steps; and (iii) removing the first and second polymers via oxidative ashing, wherein first and second polymers are different.
-
-
-
Search Results
4
records
(took 0.01 seconds)
